INTERPOSER BASED IMAGING SENSOR FOR HIGH-SPEED IMAGE ACQUISITION AND INSPECTION SYSTEMS
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IPC분류정보
국가/구분
United States(US) Patent
공개
국제특허분류(IPC7판)
G01N-021/95
H05K-013/00
H04N-005/335
출원번호
US-0622155
(2012-09-18)
공개번호
US-0176552
(2013-07-11)
발명자
/ 주소
KLA-Tencor Corporation
출원인 / 주소
KLA-Tencor Corporation
인용정보
피인용 횟수 :
0인용 특허 :
0
초록▼
The present invention includes an interposer disposed on a surface of a substrate, a light sensing array sensor disposed on the interposer, the light sensing array sensor being back-thinned and configured for back illumination, the light sensing array sensor including columns of pixels, one or more
The present invention includes an interposer disposed on a surface of a substrate, a light sensing array sensor disposed on the interposer, the light sensing array sensor being back-thinned and configured for back illumination, the light sensing array sensor including columns of pixels, one or more amplification circuitry elements configured to amplify an output of the light sensing array sensor, the amplification circuits being operatively connected to the interposer, one or more analog-to-digital conversion circuitry elements configured to convert an output of the light sensing array sensor to a digital signal, the ADC circuitry elements being operatively connected to the interposer, one or more driver circuitry elements configured to drive a clock or control signal of the array sensor, the interposer configured to electrically couple at least two of the light sensing array sensor, the amplification circuits, the conversion circuits, the driver circuits, or one or more additional circuits.
대표청구항▼
1. An interposer-based image sensing device, comprising: at least one interposer disposed on a surface of a substrate;at least one sensing array sensor disposed on the at least one interposer, the at least one light sensing array sensor being back-thinned, the at least one light sensing array sensor
1. An interposer-based image sensing device, comprising: at least one interposer disposed on a surface of a substrate;at least one sensing array sensor disposed on the at least one interposer, the at least one light sensing array sensor being back-thinned, the at least one light sensing array sensor configured for back illumination, the at least one light sensing array sensor including a plurality of columns of pixels;at least one amplification circuitry element configured to amplify an output of the at least one light sensing array sensor, the at least one amplification circuit being operatively connected to the interposer;at least one analog-to-digital conversion circuitry element configured to convert an output of the at least one light sensing array sensor to a digital signal, the at least one analog-to-digital conversion circuits being operatively connected to the interposer;at least one driver circuitry element configured to drive at least one of a clock signal or control signal of the at least one light sensitive array sensor, the at least one driver circuitry element being operatively connected to the interposer; andat least one additional circuitry element being operatively connected to the one or more interposer, the interposer configured to electrically couple at least two of the at least one light sensing array sensor, the one or more amplification circuits, the one or more conversion circuits, the one or more driver circuits, or the one or more additional circuits. 2. The apparatus of claim 1, wherein the at least one amplification circuitry element is fabricated on the interposer. 3. The apparatus of claim 1, wherein at least one of the at least one analog-to-digital conversion circuitry element, the at least one driver circuitry element, or the at least one additional circuitry element are fabricated on the interposer. 4. The apparatus of claim 1, wherein at least one of the at least one analog-to-digital conversion circuitry element, the at least one driver circuitry element, or the at least one additional circuitry element are fabricated in a separate die and disposed on the interposer. 5. The apparatus of claim 1, wherein the at least one amplifier is coupled to an output of a first column of pixels of the light sensing array sensor. 6. The apparatus of claim 1, wherein the at least one amplifier is coupled to an output of a first column of pixels of the at least one light sensing array sensor and to at least a second column of pixels of the at least one light sensing array sensor. 7. The apparatus of claim 1, wherein the at least one amplifier comprises: at least one charge conversion amplifier. 8. The apparatus of claim 1, wherein the at least one sensing array sensor disposed on the at least one interposer comprises: two or more sensing array sensors disposed on a single interposer. 9. The apparatus of claim 1, wherein the two or more sensing array sensors disposed on a single interposer comprises: two or more sensing array sensors disposed on a single interposer, the two or more sensing array sensors arranged in a rectangular grid pattern. 10. The apparatus of claim 1, wherein the two or more sensing array sensors disposed on a single interposer comprises: two or more sensing array sensors disposed on a single interposer, the two or more sensing array sensors arranged in a non-rectangular grid pattern. 11. The apparatus of claim 10, wherein the two or more sensing array sensors disposed on a single interposer, the two or more sensing array sensors arranged in a non-rectangular grid pattern, comprises: two or more sensing array sensors disposed on a single interposer, the two or more sensing array sensors arranged in a non-rectangular grid pattern, the non-rectangular grid pattern include a first series of sensing array sensors and a second series of sensing array sensors, wherein an image data stream from the first series of sensing array sensors is interleaved with an image data stream from the second series of sensing array sensors. 12. The apparatus of claim 1, wherein the at least one sensing array sensor disposed on the at least one interposer comprises: a first sensing array sensor disposed on a first interposer and at least a second sensing array disposed on at least a second interposer, the first interposer and the at least a second interposer arranged contiguously. 13. The apparatus of claim 1, wherein the at least one light sensitive sensor array comprises: at least one charged coupled device (CCD) based light sensitive sensor array. 14. The apparatus of claim 13, wherein the at least one charged coupled device based light sensitive sensor array comprises: at least one time-domain integration (TDI) based light sensitive sensor array. 15. The apparatus of claim 1, wherein the at least one light sensitive sensor array comprises: at least one light sensitive array having at least 500 pixel columns. 16. The apparatus of claim 1, further comprising: a ultraviolet (UV) anti-reflection coating disposed on a surface of the at least one light sensitive sensor array. 17. The apparatus of claim 16, wherein the ultraviolet (UV) anti-reflection coating disposed on a surface of the at least one light sensitive sensor array comprises: a thermal oxide layer, the thermal oxide layer grown a surface of the interposer. 18. The apparatus of claim 17, further comprising: one or more dielectric layers disposed on a surface of the thermal oxide layer. 19. The apparatus of claim 1, wherein the interposer comprises: a silicon interposer. 20. The apparatus of claim 1, further comprising: a support structure positioned between the at least one light sensing array sensor and the at least one interposer, wherein the support structure is configured to provide support to the at least one light sensing array sensor. 21. The apparatus of claim 1, wherein the support structure comprises: a plurality of solder balls. 22. The apparatus of claim 1, wherein the support structure comprises: a volume of epoxy resin. 23. The apparatus of claim 1, wherein the substrate has a thermal conductivity above a selected value. 24. The apparatus of claim 23, wherein the substrate comprises: a ceramic substrate. 25. The apparatus of claim 1, wherein the substrate is disposed on a printed circuit board. 26. The apparatus of claim 1, wherein the substrate is configured to provide an interface between the interposer and at least one of a printed circuit board or one or more sockets. 27. A method for fabricating an interposer-based light sensitive array sensor device, comprising: providing a substrate;disposing at least one interposer onto a surface of the substrate; anddisposing a light sensitive array sensor onto a surface of the at least one interposer, the light sensitive array sensor being back-thinned and configured for back-illumination,the at least one interposer comprising at least one of one or more amplification circuitry elements configured to amplify an output of the one or more light sensing array sensor, one or more analog-to-digital conversion circuitry elements configured to convert an output of the one or more light sensing array sensors to a digital signal, or one or more driver circuitry elements, or one or additional circuitry elements. 28. An inspection system, comprising: an illumination source configured to direct illumination toward a surface of a target object disposed on a sample stage;a detector, the detector comprising at least one light sensitive array device, the at least one light sensitive array device comprising at least one back-thinned light sensitive array sensor disposed on at least one interposer, the at least one back-thinned light sensitive array sensor further configured for back-illumination, the at least one interposer comprising at least one of one of one or more amplification circuitry elements, one or more analog-to-digital conversion circuitry elements, one or more driver circuitry elements, or one or additional circuitry elements;a set of focusing optics configured to focus illumination onto the surface of the target object; anda set of collection optics configured to direct illumination reflected from the surface of the target object to the detector. 29. The inspection system of claim 28, wherein the inspection system comprises at least one of a bright-field inspection system or a dark-field inspection system. 30. The inspection system of claim 28, wherein the illumination system is configured to generate at least one of ultraviolet (UV) light, deep UV light, extreme UV (EUV) light, or vacuum UV light. 31. The inspection system of claim 28, wherein the one or more driver circuitry elements are configured to operate with a voltage swing greater than 4 volts. 32. The inspection system of claim 28, wherein the one or more driver circuitry elements are configured to operate with both negative voltage levels and positive voltage levels. 33. The inspection system of claim 28, wherein the target object comprises: a semiconductor wafer.
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