IPC분류정보
국가/구분 |
United States(US) Patent
공개
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0691250
(2012-11-30)
|
공개번호 |
US-0152509
(2014-06-05)
|
발명자
/ 주소 |
- Liu, Monsen
- Chih, Lai Wei
- Tsai, Chung-Hao
- Hsieh, Jeng-Shien
- Yeh, En-Hsiang
- Wang, Chuei-Tang
|
출원인 / 주소 |
- Taiwan Semiconductor Manufacturing Company, Ltd.
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
0 |
초록
A device includes a patch antenna, which includes a feeding line, and a ground panel over the feeding line. The ground panel has an aperture therein. A low-k dielectric module is over and aligned to the aperture. A patch is over the low-k dielectric module.
대표청구항
▼
1. A device comprising: a patch antenna comprising: a feeding line;a ground panel over the feeding line, wherein the ground panel comprises an aperture therein;a low-k dielectric module over and aligned to the aperture; anda patch over the low-k dielectric module. 2. The device of claim 1 further co
1. A device comprising: a patch antenna comprising: a feeding line;a ground panel over the feeding line, wherein the ground panel comprises an aperture therein;a low-k dielectric module over and aligned to the aperture; anda patch over the low-k dielectric module. 2. The device of claim 1 further comprising: a molding material encircling the low-k dielectric module. 3. The device of claim 2 further comprising: a device die molded in the molding material, wherein the device die is electrically coupled to the patch antenna. 4. The device of claim 2, wherein a top surface of the molding material is substantially level with a top surface of the low-k dielectric module, and a bottom surface of the molding material is substantially level with a bottom surface of the low-k dielectric module. 5. The device of claim 2, wherein the ground panel comprises a top surface, wherein the top surface comprises: a first portion contacting a bottom surface of the low-k dielectric module; anda second portion contacting a bottom surface of the molding material. 6. The device of claim 1, wherein the low-k dielectric module has a top-view area different from a top-view area of the ground panel. 7. The device of claim 1 further comprising: an additional patch antenna comprising: an additional feeding line;an additional ground panel over the additional feeding line and comprising an additional aperture therein;an additional low-k dielectric module over and aligned to the additional aperture; andan additional patch over the additional low-k dielectric module; anda dielectric region between and separating the low-k dielectric module from the additional low-k dielectric module, wherein the dielectric region and the low-k dielectric module are formed of different materials. 8. The device of claim 1, wherein the low-k dielectric module comprises a material selected from the group consisting essentially of expended polystyrene foam, Polytetrafluoroethylene, polymethyl methacrylate, ebonite, and a porous material. 9. A device comprising: a device die;a molding material, with the device die molded therein; anda patch antenna comprising: a patch;a ground panel, wherein the patch and the ground panel are on opposite sides of the molding material; anda feeding line electrically coupled to the device die. 10. The device of claim 9 further comprising a low-k dielectric module between the patch and the ground panel, wherein the low-k dielectric module is encircled by the molding material. 11. The device of claim 10, wherein the low-k dielectric module comprises a material selected from the group consisting essentially of Styrofoam, Teflon, Lucite, Ebonite, and a porous material. 12. The device of claim 10, wherein the patch and the ground panel are in contact with opposite surfaces of the low-k dielectric module, and wherein a surface of the device die is level with a surface of the molding material. 13. The device of claim 10, wherein the patch and feeding line are in contact with opposite surfaces of the low-k dielectric module, and wherein the feeding line and the ground panel are at a same level. 14. The device of claim 10, wherein the patch and feeding line are in contact with opposite surfaces of the low-k dielectric module, and wherein the low-k dielectric module and the ground panel are on opposite sides of the feeding line. 15. A method comprising: placing a device die and a low-k dielectric module over a first carrier;molding the device die and the low-k dielectric module in a molding material;forming a ground panel of a patch antenna overlying the molding material;forming a feeding line of the patch antenna overlying the ground panel, wherein the feeding line is electrically coupled to the device die; andforming a patch of the patch antenna underlying the low-k dielectric module. 16. The method of claim 15, wherein the step of molding and the step of forming the ground panel comprise: applying the molding material over the device die and the low-k dielectric module, wherein the molding material is filled into a gap between the device die and the low-k dielectric module;grinding the molding material;exposing metal connectors of the device die; andforming the ground panel over the molding material and electrically coupled to the metal connectors. 17. The method of claim 15 further comprising: after forming the ground panel and forming the feeding line, detaching the first carrier from the molding material;before the step of forming the patch, attaching a second carrier, wherein the first carrier and the second carrier are attached to opposite sides of the molding material and the device die; andafter forming the patch, detaching the second carrier from a package comprising the molding material. 18. The method of claim 15, wherein the steps of forming the ground panel, the feeding line, and the patch comprise plating. 19. The method of claim 15, wherein the step of placing the low-k dielectric module comprises placing a pre-formed dielectric module comprising a material selected from the group consisting essentially of Styrofoam, Teflon, Lucite, Ebonite, and a porous material. 20. The method of claim 15 further comprises, at a time the patch antenna is formed, simultaneously forming a plurality of patch antennas, wherein each of the plurality of patch antennas comprises portions on opposite sides of the molding material.
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