초록 ▼

A device and method for aligning and assembling castellated chip carriers with other electrical components such as printed circuit boards or other chip carriers is disclosed. The device provides means for compressively engaging the castellations in the chip carrier thereby providing precise alignmen

A device and method for aligning and assembling castellated chip carriers with other electrical components such as printed circuit boards or other chip carriers is disclosed. The device provides means for compressively engaging the castellations in the chip carrier thereby providing precise alignment and positioning of the chip carriers relative to other components with which it is assembled. A method utilizing the device and a solder column placement device to produce a pre-leaded castellated chip carrier is also disclosed.

대표청구항 ▼

A device for aligning a castellated chip carrier comprising: a frame; engagement means operatively connected to said frame for compressively engaging at least one castellation in the opposite edges of a castellated chip carrier to be aligned; support means operatively connected to said frame to supp

A device for aligning a castellated chip carrier comprising: a frame; engagement means operatively connected to said frame for compressively engaging at least one castellation in the opposite edges of a castellated chip carrier to be aligned; support means operatively connected to said frame to support a chip carrier to be supported in a desired plane; and positioning means operatively connected to said frame to align a castellated chip carrier to be positioned with respect to at least one other component. A method of producing a pre-leaded castellated chip carrier comprising the steps of: providing a castellated chip carrier having a plurality of contact pads; compressively engaging at least one castellation in opposed sides of the carrier; providing a solder column placement device having a generally planar body and a plurality of discrete electrically conductive and fusible elements therethrough, said elements being generally perpendicular to said plane, said elements being complementary to the contact pads; supporting the carrier in a plane parallel to the plane of the solder column placement device; positioning the carrier to align the contact pads with the conductive elements; heating the carrier and mounting device to fuse the conductive elements to the contact points; and removing the body of the solder column placement device to produce a pre-leaded carrier.