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A semiconductor device comprising a package base whose material is glass epoxy or the like, a plurality of leads which are formed in a manner to extend from the front surface to the rear surface of the package base, a semiconductor element which is fastened to the package base and which is electrica

A semiconductor device comprising a package base whose material is glass epoxy or the like, a plurality of leads which are formed in a manner to extend from the front surface to the rear surface of the package base, a semiconductor element which is fastened to the package base and which is electrically connected to the leads, and a resin which seals, at least, the semiconductor element and electrical connection parts between the element and the leads.

대표청구항 ▼

A semiconductor device comprising: a base having a front surface, rear surface and side surface, said side surface extending between the front surface and the rear surface, said side surface being nonplanar and having portions which are indented into the base, said front surface being formed in the

A semiconductor device comprising: a base having a front surface, rear surface and side surface, said side surface extending between the front surface and the rear surface, said side surface being nonplanar and having portions which are indented into the base, said front surface being formed in the shape of a square, and said base being made of a material selected from the group consisting of glass epoxy, glass phenol, tirazine, paper phenol, polyimide sand polyester; a semiconductor element fastened on said front surface; a plurality of inner leads formed on said front surface so as to surround said semiconductor element; a plurality of outer leads formed on said rear surface; a plurality of connective portions connecting said plurality of inner leads respectively to said plurality of outer leads, said plurality of connective portions being formed on the indented portions of said side surface of said base; a plurality of electrical connection parts connecting between said semiconductor element and said plurality of inner leads; and a resin sealing, at least, said semiconductor element and said plurality of electrical connection parts.