이 특허를 인용한 특허 (23)

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2. Hsieh Tzung-Rue,TWX ; Lo Wen-Wei,TWX, Global planarization method for inter-layer-dielectric and inter-metal dielectric.

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3. Sun-Chieh Chien TW; De-Yuan Wu TW; Yung-Chung Lin TW, ILD planarization method.

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4. Haggart, Jr., David Weston; Glashauser, Walter, Method for determining an endpoint and semiconductor wafer.

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5. Suwa,Takahiro; Hattori,Kazuhiro; Okawa,Shuichi; Hibi,Mikiharu, Method for filling concave portions of concavo-convex pattern and method for manufacturing magnetic recording medium.

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6. Hsiao Hsi-Mao,TWX ; Wei Wen-Shan,TWX ; Kuo Ming-Sheng,TWX ; Yu H. C.,TWX, Method for forming an inter-layer dielectric layer.

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7. Lee, Sung-Kwon; Kim, Dong-Sauk; Park, Hyung-Soon; Lee, Ho-Seok; Kim, Sang-Ik, Method for forming contact plug of semiconductor device.

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8. Lee Sahng Kyoo,KRX, Method for forming interlayer insulating film of a semiconductor device.

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14. Yun-Hung Shen TW; Yu-Lun Lin TW, Method to reduce the metal TiN ARC damage in etching back process.

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15. Sciarrillo, Samuele, Methods for forming interconnections between top electrodes in memory cells by a two-step chemical-mechanical polishing (CMP) process.

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17. Tu Tuby,TWX ; Wu Chin-Ta,TWX ; Kuang-Chao Chen,TWX ; Huang Dinos,TWX, Process for intermetal SOG/SOP dielectric planarization.

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18. Fukushima, Yasumori; Takafuji, Yutaka; Moriguchi, Masao, Semiconductor device fabrication method and semiconductor device.

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19. Sambonsugi,Yasuhiro; Kokura,Hikaru, Semiconductor device manufacture method including process of implanting impurity into gate electrode independently from source /drain and semiconductor device manufactured by the method.

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20. Sambonsugi, Yasuhiro; Kokura, Hikaru, Semiconductor device manufacture method including process of implanting impurity into gate electrode independently from source/drain and semiconductor device manufactured by the method.

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21. Wang, Sung-Li; Chang, Chih-Sheng; Sun, Sey-Ping, Semiconductor devices, FinFET devices, and manufacturing methods thereof.

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22. Wang, Sung-Li; Chen, Neng-Kuo; Shih, Ding-Kang; Chang, Meng-Chun; Lin, Yi-An; Huang, Gin-Chen; Hsu, Chen-Feng; Lin, Hau-Yu; Ko, Chih-Hsin; Sun, Sey-Ping; Wann, Clement Hsingjen, Wrap-around contact.

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23. Wang, Sung-Li; Chen, Neng-Kuo; Shih, Ding-Kang; Chang, Meng-Chun; Lin, Yi-An; Huang, Gin-Chen; Hsu, Chen-Feng; Lin, Hau-Yu; Ko, Chih-Hsin; Sun, Sey-Ping; Wann, Clement Hsingjen, Wrap-around contact on FinFET.

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