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Ceramic electrostatic chuck with built-in heater 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H02N-013/00
출원번호 US-0263533 (1994-06-22)
우선권정보 JP-0152015 (1993-06-23)
발명자 / 주소
  • Kawada Nobuo (Gunma-ken JPX) Yamaguchi Kazuhiro (Gunma-ken JPX)
출원인 / 주소
  • Shin-Etsu Chemical Co., Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 26  인용 특허 : 0

초록

A novel ceramic electrostatic chuck with built-in heater is proposed which is outstandingly durable in use with repeated cycles of heating and cooling because of the absence of troubles due to exfoliation of layers and crack formation in the ceramic body. Differently from conventional ceramic electr

대표청구항

A ceramic electrostatic chuck with built-in heater which is an integral body comprising: (a) a base plate having opposing first and second surfaces formed from a composite sintered body of a powder mixture consisting of from 5% to 50% by weight of aluminum nitride and from 95% to 50% by weight of bo

이 특허를 인용한 특허 (26)

  1. Michael H. Gilbert, Sr., Articles coated with aluminum nitride by chemical vapor deposition.
  2. Honma Junich,JPX ; Mino Kotaro,JPX ; Miyata Hisayuki,JPX ; Inoue Haruhide,JPX, Ceramic electrostatic chuck and method.
  3. Parkhe, Vijay D.; Deshpandey, Chandra V., Controlled resistivity boron nitride electrostatic chuck apparatus for retaining a semiconductor wafer and method of fabricating the same.
  4. Brown, Karl; Arellano, Nora; Sherstinsky, Semyon; Lau, Allen; Tsai, Cheng-Hsiung; Mehta, Vineet; Sansoni, Steve; Wang, Wei W., Detachable electrostatic chuck.
  5. Brown,Karl; Sherstinsky,Semyon; Wang,Wei W.; Tsai,Cheng Hsiung; Mehta,Vineet; Lau,Allen; Sansoni,Steve, Detachable electrostatic chuck for supporting a substrate in a process chamber.
  6. Parkhe, Vijay D.; Tsai, Cheng Tsiung; Sansoni, Steven V., Detachable electrostatic chuck having sealing assembly.
  7. You Wang ; Shamouil Shamouilian ; Arnold Kholodenko ; Alexander M. Veytser ; Surinder S. Bedi ; Kadthala R. Narendrnath ; Semyon L. Kats ; Dennis S. Grimard ; Wing L. Cheng ; Ananda H. Kumar, Electrostatic chuck bonded to base with a bond layer and method.
  8. Logan Joseph ; Tompkins Robert, Electrostatic chuck employing thermoelectric cooling.
  9. Hausmann Gilbert, Electrostatic chuck having a combination electrode structure for substrate chucking, heating and biasing.
  10. Matyushkin, Alexander; Koosau, Dennis; Panagopoulos, Theodoros; Holland, John, Electrostatic chuck having a plurality of heater coils.
  11. Kholodenko Arnold ; Shamouilian Shamouil ; Wang You ; Cheng Wing L. ; Veytser Alexander M. ; Bedi Surinder S. ; Narendrnath Kadthala R. ; Kats Semyon L. ; Grimard Dennis S. ; Kumar Ananda H., Electrostatic chuck having gas cavity and method.
  12. Wang, You; Shamouilian, Shamouil; Kholodenko, Arnold; Veytser, Alexander M.; Bedi, Surinder S.; Narendrnath, Kadthala R.; Kats, Semyon L.; Grimard, Dennis S.; Cheng, Wing L.; Kumar, Ananda H., Electrostatic chuck having heater and method.
  13. Shamouil Shamouilian ; You Wang ; Surinder S. Bedi ; Arnold Kholodenko ; Alexander M. Veytser ; Kadthala R. Narendrnath ; Semyon L. Kats ; Dennis S. Grimard ; Wing L. Cheng ; Ananda H. Kumar, Electrostatic chuck having improved electrical connector and method.
  14. Zucker, Martin L.; Devine, Daniel J.; Lee, Young Jai, Electrostatic chuck system and process for radially tuning the temperature profile across the surface of a substrate.
  15. Mogi Hiroshi,JPX ; Kobayashi Toshimi,JPX, Electrostatic holding apparatus and method of producing the same.
  16. Kano, Shoji; Iwai, Ryouji; Arai, Nobuo, Heating apparatus with electrostatic attraction function.
  17. Flynn, Jeffrey S.; Brandes, George R.; Vaudo, Robert P.; Keogh, David M.; Xu, Xueping; Landini, Barbara E., III-V nitride homoepitaxial material of improved quality formed on free-standing (Al,In,Ga)N substrates.
  18. Kayamoto, Takashi; Hanamachi, Toshihiko; Inokuchi, Tadashi; Adachi, Ryusuke, Layered ceramic/metallic assembly, and an electrostatic chuck using such an assembly.
  19. Hass Crystal J. ; Kelleher Patrick J., Method for forming an ion implanted electrostatic chuck.
  20. Matyushkin, Alexander; Katz, Dan; Holland, John; Panagopoulos, Theodoros; Willwerth, Michael D., Substrate processing with rapid temperature gradient control.
  21. Matyushkin, Alexander; Katz, Dan; Holland, John; Panagopoulos, Theodoros; Willwerth, Michael D., Substrate support assembly.
  22. Matyushkin, Alexander; Katz, Dan; Holland, John; Panagopoulos, Theodoros; Willwerth, Michael D., Substrate support assembly having rapid temperature control.
  23. Matyushkin, Alexander; Koosau, Dennis; Panagopoulos, Theodoros; Holland, John, Substrate support with electrostatic chuck having dual temperature zones.
  24. Kadthala R. Narendrnath ; Syed H. Askari ; Dennis S. Grimard ; Surinder S. Bedi ; Ananda H. Kumar ; Shamouil Shamouilian, Support for supporting a substrate in a process chamber.
  25. Ptasienski, Kevin; McMillin, James; Steinhauser, Louis P., Tailored heat transfer layered heater system.
  26. Mariner,John Thomas; Hejl,Timothy J.; Longworth,Douglas Alan; Lennartz,Jeffrey; Sane,Ajit; Macey,Andrew John; Leist,Jon; Devan,Thomas E., Wafer handling apparatus and method of manufacturing thereof.
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