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Chemical vapor deposition 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/00
출원번호 US-0833766 (1997-04-09)
우선권정보 GB-0011911 (1994-06-14)
발명자 / 주소
  • Crawley John A.,GBX
  • Saywell Victor J.,GBX
출원인 / 주소
  • T. Swan & Co. Limited, GBX
대리인 / 주소
    Emrich & Dithmar
인용정보 피인용 횟수 : 63  인용 특허 : 12

초록

Chemical vapor deposition reactions are carried out by introducing first and second precursors for the material to be deposited into a reaction chamber (5) along a plurality of separate discrete paths (21,24) where they are cooled prior to entry into the reaction chamber. The precursors are mixed in

대표청구항

[ We claim:] [1.] A reactor for producing a material from first and second gaseous precursors by metal organic chemical vapour deposition which reactor comprises:(i) a reaction chamber for accommodating a heated substrate having a surface upon which said material is to be deposited by reaction of sa

이 특허에 인용된 특허 (12)

  1. Ogawa Kazuyuki (Yokohama JA) Hirose Masahiko (Yokohama JA) Yada Masaaki (Kawasaki JA) Imamura Hitoshi (Yokohama JA), Activated gas reaction apparatus.
  2. Ishihara Shunichi (Ebina JPX) Hanna Jun-ichi (Yokohama JPX) Shimizu Isamu (Yokohama JPX) Hirooka Masaaki (Toride JPX), Apparatus for forming deposited film.
  3. Yoshino Akira (Osaka JPX) Ohmori Yoshinori (Osaka JPX) Ohnishi Toshiharu (Osaka JPX), Apparatus for producing semiconductors.
  4. Jones Addison B. (Yorba Linda CA), Beam source for deposition of thin film alloys.
  5. Cox Herbert M. (Berkeley Heights NJ), Deposition technique.
  6. Bhat Rajaram (Middletown NJ), Gas foil rotating substrate holder.
  7. Fischer Heinrich (Furstentum LIX), Method for a reactive surface treatment of a workpiece and a treatment chamber for practicing such method.
  8. Ahmed Irfan (31 Bradford Rd. Framingham MA 01701), Method for etching and controlled chemical vapor deposition.
  9. Anderson Roger N. (San Jose CA) Hey H. Peter W. (San Jose CA) Beinglass Israel (Sunnyvale CA) Venkatesan Mahalingam (San Jose CA), Semiconductor wafer process chamber with susceptor back coating.
  10. Hirai Toshio (Sendai JPX) Niihara Koichi (Sendai JPX), Super hard highly pure silicon nitrides and a process and apparatus for producing the same.
  11. Ono Tetsuo (Kokubunji JPX) Hiraoka Susumu (Kokubunji JPX) Saito Sakae (Tokorozawa JPX) Harada Kunio (Hachioji JPX) Tachibana Mituhiro (Fuchu JPX) Kubota Shigeo (Saitama JPX) Suzuki Keizo (Kodaira JPX, Surface treating apparatus, surface treating method and semiconductor device manufacturing method.
  12. Wang Christine A. (Bedford MA) Brown Robert A. (Winchester MA) Caunt James W. (Concord MA), Vapor phase reactor for making multilayer structures.

이 특허를 인용한 특허 (63)

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  4. Gleissner, Andreas, Apparatus for treating surfaces of wafer-shaped articles.
  5. Obweger, Rainer; Gleissner, Andreas; Engesser, Philipp, Apparatus for treating surfaces of wafer-shaped articles.
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  7. Chu, Xinsheng; Kang, Ming-Du, Cassette optimized for an inline annealing system.
  8. Kim, Changsung Sean; Choi, Chang Hwan; Hong, Jong Pa; Kim, Joong El, Chemical vapor deposition apparatus.
  9. Kim, Changsung Sean; Yoo, Sang Duk; Hong, Jong Pa; Shim, Ji Hye; Lee, Won Shin, Chemical vapor deposition apparatus.
  10. Begarney, Michael J.; Campanale, Frank J., Chemical vapor deposition reactor.
  11. Chae, Yongkee; Fu, Jianming, Chemical vapor deposition tool and process for fabrication of photovoltaic structures.
  12. Jurgensen,Holger; Kappeler,Johannes; Strauch,Gerd; Schmitz,Dietmar, Coating method.
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  14. J?rgensen,Holger; Strauch,Gerhard Karl; K?ppeler,Johannes, Device and method for the deposition of, in particular, crystalline layers on, in particular, crystalline substrates.
  15. Borean, Christophe; Delcarri, Jean-Luc, Device and process for chemical vapor phase treatment.
  16. Krücken, Thomas; Gopi, Baskar Pagadala; Dauelsberg, Martin, Gas distributor for a CVD reactor.
  17. Reinhold, Markus; Baumann, Peter; Strauch, Gerhard Karl, Gas distributor with pre-chambers arranged in planes.
  18. Lee, Jae Moo, Gas injection unit for chemical vapor desposition apparatus.
  19. Reinhold, Markus; Baumann, Peter; Strauch, Gerhard Karl, Gas inlet element for a CVD reactor.
  20. Silva, Hugo; Jouault, Nico; Saywell, Victor; Crawley, Fred; Dauelsberg, Martin; Lindner, Johannes, Gas inlet member of a CVD reactor.
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  25. Pokharna, Himansu; Xia, Li-Qun; Lim, Tian H., Lid cooling mechanism and method for optimized deposition of low-K dielectric using TR methylsilane-ozone based processes.
  26. Pokharna, Himansu; Xia, Li-Qun; Lim, Tian H., Lid cooling mechanism and method for optimized deposition of low-k dielectric using tri methylsilane-ozone based processes.
  27. Kryliouk, Olga, MOCVD single chamber split process for LED manufacturing.
  28. Moshtagh, Vahid S.; Ramer, Jeffrey C., Machine CVD shower head.
  29. Comita Paul B. ; Carlson David K. ; Riley Norma B. ; Fan Doria W. ; Ranganathan Rekha, Method for heating exhaust gas in a substrate reactor.
  30. Shimogaki,Yukihiro; Kawano,Yumiko, Method of forming an oxidation-resistant TiSiN film.
  31. Nijhawan, Sandeep; Burrows, Brian H.; Ishikawa, Tetsuya; Kryliouk, Olga; Vasudev, Anand; Su, Jie; Quach, David H.; Chang, Anzhong; Melnik, Yuriy; Ratia, Harsukhdeep S.; Nguyen, Son T.; Pang, Lily, Methods for fabricating group III nitride structures with a cluster tool.
  32. Dalton, Jeremie J.; Karim, M. Ziaul; Londergan, Ana R., Methods of providing uniform gas delivery to a reactor.
  33. Balasubramanian, Ganesh; Rocha-Alvarez, Juan Carlos; Cho, Tom K.; Raj, Daemian, Methods of uniformity control for low flow process and chamber to chamber matching.
  34. Rozenzon, Yan; Trujillo, Robert T.; Beese, Steven C., Multi-channel gas-delivery system.
  35. Song, Eddy J., Multi-gas centrally cooled showerhead design.
  36. Chandrasekharan, Ramesh; Petraglia, Jennifer L., Multi-plenum, dual-temperature showerhead.
  37. Ballance David S. ; Bierman Benjamin ; Tietz James V., Multi-zone gas flow control in a process chamber.
  38. Olgado, Donald J. K., Multiple level showerhead design.
  39. Tam, Alexander; Chang, Anzhong; Acharya, Sumedh, Multiple precursor showerhead with by-pass ports.
  40. Umotoy Salvador P. ; Lei Lawrence C. ; Nguyen Anh N. ; Chiao Steve H., One-piece dual gas faceplate for a showerhead in a semiconductor wafer processing system.
  41. Strauch, Gerhard Karl; Kaeppeler, Johannes; Reinhold, Markus; Schulte, Bernd, Process and apparatus for depositing semiconductor layers using two process gases, one of which is preconditioned.
  42. Jurgensen, Holger; Strauch, Gerhard Karl, Process for depositing thin layers on a substrate in a process chamber of adjustable height.
  43. Turlot, Emmanuel; Chevrier, Jean-Baptiste; Schmitt, Jacques; Barreiro, Jean, RF plasma reactor having a distribution chamber with at least one grid.
  44. Tam, Alexander; Chang, Anzhong; Acharya, Sumedh, Showerhead assembly with gas injection distribution devices.
  45. Shah, Kartik; Prasad, Chaitanya A.; Bautista, Kevin Joseph; Tobin, Jeffrey; Kelkar, Umesh M.; Hawrylchak, Lara, Showerhead design.
  46. Fischer, Andreas; Dhindsa, Rajinder, Showerhead electrodes and showerhead electrode assemblies having low-particle performance for semiconductor material processing apparatuses.
  47. Kim, Changsung Sean; Hong, Jong Pa; Lee, Kyung Ho, Showerhead for chemical vapor deposition and chemical vapor deposition apparatus having the same.
  48. Byun, Chulsoo; Han, Man Cheol; Chung, Il Yong; Lee, Seok Woo, Showerhead for film depositing vacuum equipment.
  49. Fujibayashi, Hiroaki; Naito, Masami; Ito, Masahiko; Kamata, Isaho; Tsuchida, Hidekazu; Ito, Hideki; Adachi, Ayumu; Nishikawa, Koichi, Silicon carbide semiconductor film-forming apparatus and film-forming method using the same.
  50. Shinriki Hiroshi,JPX ; Liu Yijun,JPX ; Sugiura Masahito,JPX, Single-substrate-processing CVD apparatus and method.
  51. Takahiro Horiguchi JP; Wataru Okase JP; Eiichiro Takanabe JP, Single-substrate-treating apparatus for semiconductor processing system.
  52. Gleissner, Andreas; Junk, Markus; Bandarapu, Bhaskar, Spin chuck with rotating gas showerhead.
  53. Melnik, Yuriy; Kryliouk, Olga; Kojiri, Hidehiro; Ishikawa, Tetsuya, Substrate pretreatment for subsequent high temperature group III depositions.
  54. Zajac, Piotr, System and method for curing conductive paste using induction heating.
  55. Sung, Edward; Zu-Yi Liu, James, Systems, method and apparatus for curing conductive paste.
  56. Sung, Edward; Zu-Yi Liu, James, Systems, method and apparatus for curing conductive paste.
  57. Rozenzon, Yan; Lavi, Gil; Lee, Evans Y.; Choi, Dong Ho; Hamrah, Matt; Luscher, Paul E.; Vaidya, Kaushik; Pu, Bryan; Fovell, Richard, Temperature controlled window with a fluid supply system.
  58. Yamada, Takakazu; Irino, Osamu; Kagami, Tsuyoshi, Thin film production apparatus and inner block for thin film production apparatus.
  59. Balasubramanian, Ganesh; Rocha Alvarez, Juan Carlos; Cho, Tom K.; Raj, Daemian, Uniformity control for low flow process and chamber to chamber matching.
  60. Takasuka, Eiryo; Ueda, Toshio; Kuramoto, Toshiyuki; Ueno, Masaki, Vapor-phase process apparatus, vapor-phase process method, and substrate.
  61. Takasuka, Eiryo; Ueda, Toshio; Kuramoto, Toshiyuki; Ueno, Masaki, Vapor-phase process apparatus, vapor-phase process method, and substrate.
  62. Takasuka, Eiryo; Ueda, Toshio; Kuramoto, Toshiyuki; Ueno, Masaki, Vapor-phase process apparatus, vapor-phase process method, and substrate.
  63. Comita Paul B. ; Carlson David K. ; Riley Norma B. ; Fan Doria W. ; Ranganathan Rekha, Vented lower liner for heating exhaust gas from a single substrate reactor.
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