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High quality silicon oxide films by remote plasma CVD from disilane precursors 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/02
출원번호 US-0876538 (2007-10-22)
등록번호 US7867923 (2010-12-28)
발명자 / 주소
  • Mallick, Abhijit Basu
  • Nemani, Srinivas D.
  • Yieh, Ellie
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Townsend and Townsend and Crew
인용정보 피인용 횟수 : 48  인용 특허 : 80

초록

A method of depositing a silicon and nitrogen containing film on a substrate. The method includes introducing silicon-containing precursor to a deposition chamber that contains the substrate, wherein the silicon-containing precursor comprises at least two silicon atoms. The method further includes g

대표청구항

What is claimed is: 1. A method of depositing a silicon and nitrogen containing film on a substrate, the method comprising:introducing silicon-containing precursor to a deposition chamber that contains the substrate, wherein the silicon-containing precursor comprises at least two silicon atoms;gener

이 특허에 인용된 특허 (80)

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