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[미국특허] Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23F-001/00
  • H01L-021/306
출원번호 US-0409292 (2006-04-21)
등록번호 US-8092638 (2012-01-10)
발명자 / 주소
  • Brillhart, Paul Lukas
  • Fovell, Richard
  • Tavassoli, Hamid
  • Buchberger, Jr., Douglas A.
  • Burns, Douglas H.
  • Bera, Kallol
  • Hoffman, Daniel J.
출원인 / 주소
  • Applied Materials Inc.
대리인 / 주소
    Knobbe, Martens, Olson & Bear LLP.
인용정보 피인용 횟수 : 6  인용 특허 : 84

초록

A plasma reactor for processing a workpiece includes a reactor chamber, an electrostatic chuck within the chamber for supporting a workpiece, an RF plasma bias power generator coupled to apply RF power to the electrostatic chuck and a refrigeration loop having an evaporator inside the electrostatic

대표청구항

1. A plasma reactor for processing a workpiece, comprising: a reactor chamber;an electrostatic chuck within said chamber comprising an upper insulating puck layer having a top surface for supporting a workpiece and a lower conductive base layer, and an axial cylindrical probe hole extending through

이 특허에 인용된 특허 (84)

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이 특허를 인용한 특허 (6)

  1. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Capacitively coupled plasma reactor having very agile wafer temperature control.
  2. Shiraiwa, Norio; Kawai, Jiro, Electrostatic chuck and semiconductor-liquid crystal manufacturing apparatus.
  3. Park, Haejoong; Kim, Hongmyoung; Baek, Kye Hyun; Park, Sangkyu, Electrostatic chuck assemblies capable of bidirectional flow of coolant and semiconductor fabricating apparatus having the same.
  4. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor.
  5. Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with a multiple zone thermal control feed forward control apparatus.
  6. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes.

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