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Provided is a dry etcher including an etching device and a cleaning device, more particularly, a dry etcher including an etching device and a cleaning device to which a cleaning process is added so as to be used in a metal layer etching process. The dry etcher includes an etching device into which e

Provided is a dry etcher including an etching device and a cleaning device, more particularly, a dry etcher including an etching device and a cleaning device to which a cleaning process is added so as to be used in a metal layer etching process. The dry etcher includes an etching device into which etching gas is injected to etch a layer formed on a substrate, a substrate transfer device transferring the substrate processed by the etching device, and a cleaning device cleaning the substrate transferred by the substrate transfer device.

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1. A dry etcher comprising: an etching device comprising an etching chamber into which etching gas is injected so as to etch a layer formed on a substrate within the etching chamber;a substrate transfer device configured to transfer the substrate processed by the etching device; anda cleaning device

1. A dry etcher comprising: an etching device comprising an etching chamber into which etching gas is injected so as to etch a layer formed on a substrate within the etching chamber;a substrate transfer device configured to transfer the substrate processed by the etching device; anda cleaning device comprising a chamber spaced apart from the etching device chamber, wherein the cleaning device is configured to clean the substrate transferred by the substrate transfer device, wherein the cleaning device comprises an in-shower knife configured to inject deionized water onto the transferred substrate, and an air knife configured to inject gas so as to dry the transferred substrate, wherein the air knife is inclined horizontally relative to the in-shower knife and is inclined vertically relative to the substrate, wherein the in-shower knife and the air knife are fixed to a single movable frame with a predetermined interval between the in-shower knife and the air knife, and wherein the in-shower knife can inject deionized water and the air knife can inject gas when the frame is stationary and when the frame is moved. 2. The dry etcher of claim 1, wherein the etching gas contains chlorine or fluorine. 3. The dry etcher of claim 1, wherein the layer formed on the substrate is made of a metal. 4. The dry etcher of claim 1, wherein the etching device comprises an inlet through which the etching gas is injected, and wherein the etching chamber provides a space used to perform an etching process in which the etching gas injected through the inlet is used. 5. The dry etcher of claim 4, wherein the etching device further comprises a diffuse plate provided with a plurality of through holes so that the etching gas injected through the inlet is diffused in the etching chamber. 6. The dry etcher of claim 1, wherein the cleaning device further comprises a suction knife for suction. 7. The dry etcher of claim 6, wherein the suction knife is fixed to the movable frame and can operate when the frame is stationary and when the frame is moved. 8. The dry etcher of claim 1, wherein the substrate transfer device feeds the substrate processed in the etching device by using the rotation of rollers that are fixed to a plurality of shafts. 9. The dry etcher of claim 1, wherein the substrate transfer device transfers the substrate from the etching device to the cleaning device by using an index robot, the index robot comprising fingers picking up the substrate, a plurality of rods supporting the fingers, and shafts rotating the rods. 10. The dry etcher of claim 1, further comprising a buffer device temporarily storing the substrate processed by the etching device prior to transfer to the cleaning device.