초록 ▼

The object of the present invention is to provide a novel cleaner composition that not only reduces ignition by flame and has a small influence on the environment, but that also has an excellent property of dissolving flux residues adhered on narrow portions or in narrow gaps in an object to be clea

The object of the present invention is to provide a novel cleaner composition that not only reduces ignition by flame and has a small influence on the environment, but that also has an excellent property of dissolving flux residues adhered on narrow portions or in narrow gaps in an object to be cleaned that was subjected to soldering with a lead-free solder, and reduces recontamination of the object in the water-rinsing process. The present invention uses a halogen-free organic solvent (A) represented by a specific Formula; an amine-based compound (B) represented by a specific Formula; a chelating agent having no amino group (C); and, as required, water.

대표청구항 ▼

1. A cleaner composition for removing lead-free soldering flux, consisting of a halogen-free organic solvent (A) formed of a compound represented by Formula (1-1) and/or a compound represented by Formula (1-2); an amine-based compound (B) represented by Formula (2); a chelating agent having no amino

1. A cleaner composition for removing lead-free soldering flux, consisting of a halogen-free organic solvent (A) formed of a compound represented by Formula (1-1) and/or a compound represented by Formula (1-2); an amine-based compound (B) represented by Formula (2); a chelating agent having no amino group (C); as required, water, and as required, nonionic surfactants (excluding the compounds used as Components (A) and (B)), anionic surfactants (excluding polyoxyethylene phosphoric acid ester-based surfactants), cationic surfactants, antifoaming agents, antirusts, and antioxidants, the cleaner composition containing 0.01 to 30 parts by weight of the amine-based compound (B), 0.01 to 10 parts by weight of the chelating agent having no amino group (C), and 0 to 10 parts by weight of water, per 100 parts by weight of the halogen-free organic solvent (A) wherein R1 represents C1-6 alkyl group, R2 represents methyl group or hydrogen atom, X1 represents C1-5 alkyl group or hydrogen atom, and “a” represents an integer ranging from 2 to 4, wherein R3 represents C1-6 alkyl group, R4 represents methyl group or hydrogen atom, X2 represents C1-5 alkyl group or hydrogen atom, and “b” represents an integer ranging from 2 to 4, wherein R5 represents C1-7 alkyl group, Y represents C1-5 alkyl group or hydrogen atom, “c” is an integer ranging from 1 to 15, and “d” is an integer ranging from 0 to 15. 2. The cleaner composition for removing lead-free soldering flux according to claim 1, wherein the cleaner composition comprises, as the halogen-free organic solvent (A), the compound represented by Formula (1-1) and the compound represented by Formula (1-2) at a weight ratio of 5/1 to 1/5. 3. The cleaner composition for removing lead-free soldering flux according to claim 1, wherein the amine-based compound (B) is an N-alkyl dialkanolamine. 4. The cleaner composition for removing lead-free soldering flux according to claim 3, wherein the N-alkyl dialkanolamine is at least one member selected from the group consisting of N-methyl diethanolamine, N-ethyl diethanolamine, N-butyl diethanolamine and N-propyl diethanolamine. 5. The cleaner composition for removing lead-free soldering flux according to claim 1, wherein the chelating agent having no amino group (C) is an aliphatic hydroxycarboxylic acid-based chelating agent and/or a (poly) phosphoric acid-based chelating agent. 6. The cleaner composition for removing lead-free soldering flux according to claim 5, wherein the aliphatic hydroxycarboxylic acid-based chelating agent is at least one member selected from the group consisting of citric acid, isocitric acid and malic acid. 7. The cleaner composition for removing lead-free soldering flux according to claim 5, wherein the (poly) phosphoric acid-based chelating agent is at least one member selected from the group consisting of orthophosphoric acid, pyrophosphoric acid and triphosphoric acid. 8. The cleaner composition for removing lead-free soldering flux according to claim 1, wherein a measurement value measured by a B-type viscosity meter is 1 to 10 mPa·s/(20° C., 60 rpm, rotor No. 1) when the cleaner composition contains 5 wt. % of water. 9. A method for removing lead-free soldering flux, comprising bringing the cleaner composition for removing lead-free soldering flux according to claim 1 in contact with lead-free soldering flux. 10. A method for removing lead-free soldering flux, comprising spraying the cleaner composition for removing lead-free soldering flux according to claim 1 to lead-free soldering flux to obtain a cleaned object, and spraying water to the cleaned object. 11. The cleaner composition for removing lead-free soldering flux according to claim 2, wherein the amine-based compound (B) is an N-alkyl dialkanolamine. 12. The cleaner composition for removing lead-free soldering flux according to claim 11, wherein the N-alkyl dialkanolamine is at least one member selected from the group consisting of N-methyl diethanolamine, N-ethyl diethanolamine, N-butyl diethanolamine and N-propyl diethanolamine. 13. The cleaner composition for removing lead-free soldering flux according to claim 2, wherein the chelating agent having no amino group (C) is an aliphatic hydroxycarboxylic acid-based chelating agent and/or a (poly) phosphoric acid-based chelating agent. 14. The cleaner composition for removing lead-free soldering flux according to claim 13, wherein the aliphatic hydroxycarboxylic acid-based chelating agent is at least one member selected from the group consisting of citric acid, isocitric acid and malic acid. 15. The cleaner composition for removing lead-free soldering flux according to claim 13, wherein the (poly) phosphoric acid-based chelating agent is at least one member selected from the group consisting of orthophosphoric acid, pyrophosphoric acid and triphosphoric acid. 16. The cleaner composition for removing lead-free soldering flux according to claim 3, wherein the cleaner composition contains 0.01 to 30 parts by weight of the amine-based compound (B), 0.01 to 10 parts by weight of the chelating agent having no amino group (C), and 0 to 10 parts by weight of water, per 100 parts by weight of the halogen-free organic solvent (A). 17. The cleaner composition for removing lead-free soldering flux according to claim 5, wherein the cleaner composition contains 0.01 to 30 parts by weight of the amine-based compound (B), 0.01 to 10 parts by weight of the chelating agent having no amino group (C), and 0 to 10 parts by weight of water, per 100 parts by weight of the halogen-free organic solvent (A).