Organic space transformer attachment and assembly
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G01R-001/073
G01R-031/28
H05K-003/32
출원번호
US-0142752
(2013-12-28)
등록번호
US-9581639
(2017-02-28)
발명자
/ 주소
Yang, Jin
Acar, Erkan
Albertson, Todd P.
Walczyk, Joe F.
출원인 / 주소
INTEL CORPORATION
대리인 / 주소
Konrad Raynes Davda & Victor LLP
인용정보
피인용 횟수 :
0인용 특허 :
2
초록▼
Electronic device assemblies and methods including an organic substrate based space transformer are described. One assembly includes a space transformer comprising an organic substrate. The assembly also includes a carrier on which the space transformer is positioned, and a clamp positioned to coupl
Electronic device assemblies and methods including an organic substrate based space transformer are described. One assembly includes a space transformer comprising an organic substrate. The assembly also includes a carrier on which the space transformer is positioned, and a clamp positioned to couple the space transformer to the carrier. The assembly also includes a probe array positioned on the space transformer, wherein the space transformer is positioned between the probe array and the carrier. The assembly also includes a printed circuit board, wherein the carrier is positioned between the printed circuit board and the space transformer. The assembly also includes electrical connections to electrically couple the space transformer to the printed circuit board. Other embodiments are described and claimed.
대표청구항▼
1. An electronic device assembly comprising: a space transformer comprising an organic substrate, the space transformer including a first surface and a second surface opposite the first surface;a carrier on which the space transformer is positioned, wherein the second surface of the space transforme
1. An electronic device assembly comprising: a space transformer comprising an organic substrate, the space transformer including a first surface and a second surface opposite the first surface;a carrier on which the space transformer is positioned, wherein the second surface of the space transformer is positioned between the carrier and the first surface of the space transformer;a clamp positioned to extend over a portion of the first surface of the space transformer and couple the space transformer to the carrier, wherein the space transformer under the clamp is sandwiched between the clamp and the carrier;a probe assembly positioned on the first surface of the space transformer, wherein the space transformer is positioned between the probe assembly and the carrier, wherein the first surface of the space transformer is positioned between the probe assembly and the second surface of the space transformer; andthe carrier configured to include a plurality of openings extending through the carrier, through which electrical connections may be made from the space transformer to a printed circuit board. 2. The electronic device assembly of claim 1, further comprising the printed circuit board and the electrical connections from the space transformer to the printed circuit board, the electrical connections extending through the openings in the carrier, the electrical connections comprising pins extending through the openings, the printed circuit board positioned to engage the carrier. 3. The electronic device assembly of claim 1, further comprising a pin holder positioned in a recess in the carrier, the pin holder including a plurality of pins electrically coupled to the space transformer. 4. The electronic device assembly of claim 2, including a plurality of screws through which the carrier is removably coupled to the printed circuit board. 5. The electronic device assembly of claim 1, wherein the carrier defines an open region extending through a thickness of the carrier in a central portion thereof, and wherein a support structure is positioned within the open region, and wherein a central portion of the space transformer is positioned on the support structure. 6. The electronic device assembly of claim 1, wherein the probe assembly comprises a probe holder and a plurality of probes, and wherein the clamp extends outward from the first surface of the space transformer a distance greater than that of the probe holder. 7. The electronic device assembly of claim 1, wherein the probe assembly comprises a probe holder and a plurality of probes, and wherein the clamp extends outward from the first surface of the space transformer a distance less than that of the probe holder. 8. The electronic device assembly of claim 1, further comprising a daughter board positioned between the space transformer and the carrier, wherein the space transformer is electrically coupled to the daughter board. 9. An electronic device assembly comprising: a space transformer comprising an organic substrate;a probe assembly comprising a plurality of test probes, the probe assembly positioned on the space transformer and the test probes electrically coupled thereto;a carrier on which the space transformer is positioned;the carrier configured to include a plurality of openings extending therethrough;a plurality of pins extending through the openings, wherein electrical connections may be made from the space transformer to a printed circuit board through the pins;a clamp coupled to the carrier, the clamp including a plate extending over a portion of the probe assembly and positioned to hold the space transformer on the carrier; andwherein the carrier is configured to removably engage a printed circuit board. 10. The electronic device assembly of claim 9, further comprising an adhesive positioned between the space transformer and at least one of the carrier and the clamp. 11. The electronic device assembly of claim 9, wherein the clamp is removably coupled to the carrier. 12. The electronic device assembly of claim 11, further comprising the printed circuit board, wherein the carrier is removably coupled to the printed circuit board using a first plurality of screws, and the clamp is removably coupled to the carrier using a second plurality of screws, wherein the second plurality of screws do not extend through any portion of the space transformer. 13. The electronic device assembly of claim 9, further comprising a plurality of pins extending through the openings in the carrier. 14. The electronic device assembly of claim 9, including a plurality of screws through which the clamp is removably coupled to the carrier, wherein the screws do not extend through any portion of the space transformer. 15. A method for forming an electronic device assembly, comprising: positioning a space transformer on a carrier, the space transformer comprising an organic substrate;clamping the space transformer to the carrier using a clamp comprising a plate extending over a first surface of the space transformer, wherein the space transformer under the clamp is sandwiched between the plate and the carrier;bonding the space transformer to at least one of the clamp and the carrier using an adhesive, prior to the clamping the space transformer to the carrier;coupling a probe assembly to the first surface of the space transformer, so that the space transformer is positioned between the probe assembly and the carrier;positioning a plurality of openings extending through the carrier and sized to accept pins extending therethrough; andpositioning a plurality of pins to extend through the openings to form electrical connections between the space transformer and a printed circuit board. 16. The method of claim 15, wherein the bonding the space transformer includes positioning the adhesive between at least one of: (i) the space transformer and the carrier, and (ii) the space transformer and the clamp. 17. The method of claim 15, further comprising positioning a probe array on the space transformer after the clamping the space transformer to the carrier using the clamp. 18. An electronic device assembly comprising: a space transformer comprising an organic substrate, the space transformer including an upper surface and a lower surface;a carrier on which the lower surface of the space transformer is positioned;a clamp positioned to couple the space transformer to the carrier, the clamp comprising a plate configured to engage a portion of the upper surface of the space transformer;a probe assembly positioned on the upper surface of the space transformer, wherein the space transformer is positioned between the probe assembly and the carrier;the carrier configured to engage a printed circuit board; andthe carrier configured to include a plurality of openings extending through the carrier; through which electrical connections may be made from the space transformer to the printed circuit board;the carrier configured to include a plurality of openings extending therethrough; anda plurality of pins extending through the openings in the carrier and electrically coupled the space transformer, the pins configured to be coupled to the printed circuit board, the openings configured to be larger than the pins so that a pin positioned in an opening is separated from an interior wall of the carrier by a portion of the opening. 19. The electronic device assembly of claim 18, wherein the space transformer includes a side surface, wherein the clamp includes a portion extending outward beyond the side surface, and wherein the clamp is coupled to the carrier through an attachment mechanism extending through the portion extending outward beyond the side surface. 20. The electronic device assembly of claim 1, further comprising a plurality of pins positioned in the openings. 21. The electronic device assembly of claim 20, the openings configured to be larger than the pins so that a pin positioned in an opening is separated from an interior wall of the carrier by a portion of the opening.
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