Integration of through glass via (TGV) filter and acoustic filter
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-001/02
H05K-003/32
H03H-009/02
H03H-009/10
H03H-003/02
H03H-009/05
H03H-003/08
출원번호
15798071
(2017-10-30)
등록번호
10582609
(2020-03-03)
발명자
/ 주소
Yun, Changhan Hobie
Kim, Jonghae
Yu, Xiaoju
Velez, Mario Francisco
Chen, Wei-Chuan
Mudakatte, Niranjan Sunil
Nowak, Matthew Michael
Hoffmann, Christian
Pacher Fernandes, Rodrigo
Hofer, Manuel
Bainschab, Peter
Schmidhammer, Edgar
Hatzl, Stefan Leopold
출원인 / 주소
QUALCOMM Incorporated
대리인 / 주소
Qualcomm Incorporated/Seyfarth Shaw LLP
인용정보
피인용 횟수 :
0인용 특허 :
0
초록
A passive on glass (POG) on filter capping apparatus may include an acoustic filter die. The apparatus may further include a capping die electrically coupled to the acoustic filter die. The capping die may include a 3D inductor.
대표청구항▼
1. A passive on glass (POG) on filter capping apparatus, comprising: an acoustic filter die;a capping die electrically coupled to the acoustic filter die, the capping die including at least a portion of a 3D inductor, anda capacitor directly coupled to the 3D inductor though a trace of a plurality o
1. A passive on glass (POG) on filter capping apparatus, comprising: an acoustic filter die;a capping die electrically coupled to the acoustic filter die, the capping die including at least a portion of a 3D inductor, anda capacitor directly coupled to the 3D inductor though a trace of a plurality of traces that is part of the capacitor and also part of the 3D inductor. 2. The apparatus of claim 1, in which the capping die is arranged to near-hermetically seal the acoustic filter die. 3. The apparatus of claim 1, in which the 3D inductor comprises a plurality of vias coupled together with the plurality of traces on opposing surfaces of the capping die. 4. The apparatus of claim 1, in which the capping die is coupled to the acoustic filter die through a plurality of vias. 5. The apparatus of claim 1, in which the capping die is coupled to the acoustic filter die through external plating. 6. The apparatus of claim 1, in which the capping die comprises an amorphous material. 7. The apparatus of claim 1, integrated into a radio frequency (RF) front end module, the RF front end module incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, a mobile phone, and a portable computer. 8. The apparatus of claim 1, in which the capacitor and the 3D inductor comprise a filter. 9. A method of fabricating a passive on glass (POG) on filter capping apparatus, comprising: fabricating a plurality of vias in a capping die;coupling the plurality of vias together with traces on opposing surfaces of the capping die to form a 3D inductor, one of the traces comprising a plate of a capacitor; andcoupling the capping die to an acoustic filter die. 10. The method of claim 9, further comprising integrating the POG on filter capping apparatus into a radio frequency (RF) front end module, the RF front end module incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, a mobile phone, and a portable computer. 11. The method of claim 9, in which fabricating the plurality of vias comprises: opening a plurality of trenches in the capping die with a blind via formation process;filling the plurality of trenches to form the plurality of vias; andbackgrinding the capping die to expose the plurality of vias. 12. The method of claim 9, in which the coupling comprises depositing conductive traces on the opposing surfaces of the capping die to form the 3D inductor. 13. A passive on glass (POG) on filter capping apparatus, comprising: Means for filtering;a glass capping die electrically coupled to the means for filtering, the glass capping die including at least a portion of a 3D inductor, anda capacitor directly coupled to the 3D inductor though a trace of a plurality of traces that is part of the capacitor and also part of the 3D inductor. 14. The apparatus of claim 13, integrated into a radio frequency front end module, the radio frequency front end module incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, a mobile phone, and a portable computer. 15. The apparatus of claim 13, in which the glass capping die is arranged to near-hermetically seal the means for filtering. 16. The apparatus of claim 13, in which the 3D inductor comprises a plurality of vias coupled together with the plurality of traces on opposing surfaces of the capping die. 17. The apparatus of claim 13, in which the glass capping die is coupled to the means for filtering through a plurality of vias. 18. The apparatus of claim 13, in which the glass capping die is coupled to the means for filtering through external plating. 19. The apparatus of claim 13, in which the capacitor and the 3D inductor comprise a filter.
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