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NTIS 바로가기한국정밀공학회지 = Journal of the Korean Society for Precision Engineering, v.21 no.5 = no.158, 2004년, pp.32 - 37
최재영 , 정성일 () , 박기현 () , 정해도 () , 박재홍 (Rodel-Nitt) , 키노시타마사하루 (Rodel-Nitta)
Polishing processes are widely used in the glass, optical, die and semiconductor industries. Chemical Mechanical Polishing (CMP) especially is becoming one of the most important ULSI processes for the 0.25m generation and beyond. CMP is conventionally carried out using abrasive slurry and a polishin...
Castellano, H., 'CMP Technology: Competition, Pro ducts, Markets, ' The Information Network, williamsburg, pp.21-25
Hocheng, H., Huang, Y.L. and Chen, L.J., 'Kinematic Analysis and Measurement of Temperature Rise on a Pad in Chemical Mech anical Planarization,' J. of Electrochemical, Soc., Vol. 146, No.11, pp.4236-4239, 1999
Steigwald, J.M., 'Chemical mechanical planarization of microelectronic materals,' Elsevier, pp.10-15, 1987
Nguyen, V.H., Daamen, R., Kranenburg, H.V., Velden, P.V. and Worelee, P.H., 'A Physical Model for Dishing during Metal CMP,' J. of Electrochemical Soc., Vol.150, No.11, pp.689-693, 2003
Chung, S.I., Im, Y.G., Kim, H.Y., Jeong, H.D. and Dornfeld, D.A. 'Evaluation of micro-replication technology using silicone robber molds and its applications,' International J. of Machine Tools & Manufacture, Vol.43, pp.1337-1345, 2003
Kim, N.H., Kim, I.P., Kim, S.Y., Seo, Y.J. and Chang, E.G. 'Effects of Pad Characteristics on Metal CMP,' CMP-MIC Conference, pp. 86-89, 2003
Park, K.H., Jeong, Y.S., Kim, H.J. and Jeong, H.D. 'A study on groove density of Polishing Pad on Chemical Mechanical Polishing,' Proceedings of the KSPE Autumn Annual Meeting, 2003
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