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This paper deals with the design of a heat dissipation system, which consists of a heat source of power semiconductor devices, a heat sink ;md a fan for the forced air cooling. It suggests the method of appropriately dividing the whole heat transfer system into analytical subsystems and also present...

This paper deals with the design of a heat dissipation system, which consists of a heat source of power semiconductor devices, a heat sink ;md a fan for the forced air cooling. It suggests the method of appropriately dividing the whole heat transfer system into analytical subsystems and also presents the correspondent analytic or experimental design equations for the subsystems. The experimental results on the designed heat dissipation system for the 400kW IGBT inverter show less than 10［%］ error with respect to the design temperature and therefore verify the validity of the proposed analytical design method in the steady state.

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