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NTIS 바로가기Journal of semiconductor technology and science, v.12 no.1, 2012년, pp.53 - 58
Kim, Ju-Young (Department of Electronic Engineering, Hankuk University of Foreign Studies) , Choi, Min-Kwon (Department of Electronic Engineering, Hankuk University of Foreign Studies) , Lee, Seong-Hearn (Department of Electronic Engineering, Hankuk University of Foreign Studies)
A new on-wafer de-embedding method using thru, short and open patterns sequentially is proposed to eliminate the errors of conventional methods. This "thru-short-open" method is based on the removal of the coupling admittance between input and output interconnect dangling legs. The increase of the d...
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M. C. A. M. Koolen, J. A. M. Geelen and M. P. J. G. Versleijen, "An improved de-embedidng technique for on-wafer high-frequency characterization," in Proc. IEEE Bipolar Circuits Tech. Meet., pp.188-191, Sep., 1991.
S. Lee, "Effects of pad and interconnection parasitics on forward transit time in HBTs," IEEE Trans. Electron Devices, Vol.46, No.2, pp.275-280, Feb., 1999.
H. Cho and D. Burk, "A three step method for the de-embedding of high frequency S-parameter measurements," IEEE Trans. Electron Devices, Vol.38, No.6, pp.1371-1375, June, 1991.
E. P. Vandamme, D. M. M. P. Schreurs and C. V. Dinther, "Improved three-step de-embedding method to accurately account for the influence of pad parasitics in silicon on-wafer RF test-structures," IEEE Trans. Electron Devices, Vol.48, No.4, pp.737-742, Apr., 2001.
J. Cha, J. Cha and S. Lee, "Uncertainty analysis of two-step and three-step methods for deembedding on-wafer RF transistor measurements," IEEE Trans. Electron Devices, Vol.55, No.8, pp.2195-2201, Aug., 2008.
T. E. Kolding, "On-wafer calibration techniques for giga-hertz CMOS measurements," in Proc. IEEE Int. Microelectronic Test Structures Conf., pp.105-110, Mar., 1999.
J. Song, F. Ling, G. Flynn, W. Blood and E. Demircan, "A de-embedding technique for interconnects," in Proc. Electrical Perfomance of Electonic Packaging, pp.129-132, Oct., 2001.
H. Ito and K. Masu, "A simple through-only deembedding method for on-wafer S-parameter measurements up to 110 GHz," in IEEE MTT-S Int. Microwave Symposium Digest, pp.383-386, Jun., 2008.
A. Issaoun, Y. Z. Xiong, J. Shi, J. Brinkhoff and F. Lin, "On the deembedding issue of CMOS multigigahertz measurements," IEEE Trans. Microwave Theory and Techniques, Vol.55, No.9, pp.1813-1823, Sep., 2007.
J.-Y. Cha, J.-Y. Cha, and S. Lee, "Scalable BSIM3v3 RF Modeling for CMOS IC Simulation," in Proc. of International SoC Design Conf., pp.529-530, Oct., 2007.
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