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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.19 no.2, 2012년, pp.29 - 33
Kang, Sung-Geun (Microsystem Packaging Center, Seoul Technopark) , Lee, Ji-Eun (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology) , Kim, Eun-Sol (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology) , Lim, Na-Eun (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology) , Kim, Soo-Hyung (Microsystem Packaging Center, Seoul Technopark) , Kim, Sung-Dong (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology) , Kim, Sarah Eun-Kyung (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology)
The demand for 3D wafer level integration has been increasing significantly. Although many technical challenges of wafer stacking are still remaining, wafer stacking is a key technology for 3D integration due to a high volume manufacturing, smaller package size, low cost, and no need for known good ...
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