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선택한 단어 수는 30입니다.
최대 10 단어까지만 선택 가능합니다.
최대 10 단어까지만 선택 가능합니다.
제안 방법
- The overall results revealed several elevated temperature influences including possible laminate (epoxy) weakening at higher temperature leading early laminate crack initiation at elevated temperature condition and less than expected IMC weakening or strengthening at higher temperature to shock induced strain. But since the test in this study was on one shock level (200G), it is too early to conclude the elevated temperature effect, where shock induced strain still can be observed for lower G level shock inputs, which is a topic to look further.
- Three clear crack paths can be identified, two crack paths at the package side from the left and right interface, and a crack propagation at the laminate material under the Cu pad on the board side. Often, it is the pad design, which define the dominant crack propagation mode, thus this study were conducted on both solder mask defined (SMD) and Non-solder mask defined (NSMD) pad designs at the board side. Addition to the pad design factor, one additional factor is the capability of the solder joint, how much shock energy it can absorb.
대상 데이터
- In this study observing the shock performance, 1.0-mm-pitch daisy-chained full-array flip chip ball grid array (FCBGA) packages with a size of 52.5 mm × 52.5 mm were used.
- A calibrated current was passed through the inner daisy chain region to bring the temperature up to 100℃ at the corner joints, which was measured by a K-type thermocouple. Sn-3.0Ag-0.5Cu (wt%) (SAC305) solder alloy solder joints and solder paste were used for assembly. The PCB used was an organic solderability preservative (OSP) finish high-Tg FR4 test board.
- 5Cu (wt%) (SAC305) solder alloy solder joints and solder paste were used for assembly. The PCB used was an organic solderability preservative (OSP) finish high-Tg FR4 test board. As seen in Fig.
- This study presented here, is subject to see the overall shock performance of a 52.5×52.5mm2 Flip Chip ball grid array (FCBGA) component at both room temperature and 100℃ temperature environment.
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