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ETRI journal, v.36 no.3, 2014년, pp.343 - 351
Eom, Yong-Sung (Components & Materials Research Laboratory, ETRI) , Son, Ji-Hye (Components & Materials Research Laboratory, ETRI) , Jang, Keon-Soo (Department of Macromolecular Science and Engineering, Case Western Reserve University) , Lee, Hak-Sun (Components & Materials Research Laboratory, ETRI) , Bae, Hyun-Cheol (Components & Materials Research Laboratory, ETRI) , Choi, Kwang-Seong (Components & Materials Research Laboratory, ETRI) , Choi, Heung-Soap (Department of Mechanical & Design Engineering, Hongik University)
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For the fine-pitch application of flip-chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro-encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetr...
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S.C. Johnson, "Flip-Chip Packaging Becomes Competitive," Semiconductor Int., May 2009.
Since IBM invented the controlled collapse chip connection, which was known as the C4 process in the 1960s, many applications based on flip-chip bonding technologies have been developed [1].
Y.-S. Eom et al., "Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder," ETRI J., vol. 32, no. 3, June 2010, pp. 414-421.
타임라인에서 보기
To overcome the problems observed in a conventional flipchip bonding process, fluxing and hybrid underfill materials were developed in previous researches [2]–[6].
In the present research, instead of the NC used in previous researches [2]–[6], latent catalysts were used to control the pot life at room temperature and the speed of the chemical reaction during the flip-chip bonding process.
As introduced in previous research [2], the fluxing underfill and resin matrix of the hybrid underfill are composed of four components: a base resin, a curing agent, a fluxing agent to remove the oxide layer formed on the surface of the solder and Cu pads, and an MEC to control the speed of the chemical reaction at room temperature during the process.
To identify the latent effect of MECs, an NC that was used in [2] was also applied in this research.
It was inferred that these endothermic peaks were caused by the melting of the fluxing agent indicated in [2].
Y.-S. Eom et al., "Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film," Microelectron. Eng., vol. 85, no. 2, Feb. 2008, pp. 327-331.
J.-W. Baek et al., "Chemo-rheological Characteristic of a Selfassembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder," Microelectron. Eng., vol. 87, no. 10, Oct. 2010, pp. 1968-1972.
Y.-S. Eom et al., "Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive," ETRI J., vol. 33, no. 6, Dec. 2011, pp. 864-870.
타임라인에서 보기
To overcome the problems observed in a conventional flipchip bonding process, fluxing and hybrid underfill materials were developed in previous researches [2]–[6].
In the present research, instead of the NC used in previous researches [2]–[6], latent catalysts were used to control the pot life at room temperature and the speed of the chemical reaction during the flip-chip bonding process.
K.-S. Choi et al., "Novel Bumping Material for Solder-on-Pad Technology," ETRI J., vol. 33, no. 4, Aug. 2011, pp. 637-640.
Y.-S. Eom et al., "Optimization of Material and Process for Fine Pitch LVSoP Technology," ETRI J., vol. 35, no. 4, Aug. 2013, pp. 625-631.
X. Zhang et al., "Latent Curing Agent Modified Epoxy Sizing Agent for High Modulus Carbon Fiber," The Open Mater. Sci. J., vol. 5, 2011, pp. 104-108.
Many researches have tried to use a latent curing agent with liquid and powder states [12]–[15].
J.-K. Lee et al., "Cationic Cure of Epoxy Resin by an Optimum Concentration of N-benzylpyrazinium Hexafluoroantimonate," Macromolecular Res., vol. 10, no. 1, Feb. 2002, pp. 34-39.
M.-J. Shin et al., "Microencapsulation of Imidazole Curing Agents by Spray-Drying Method Using W/O Emulsion," J. Appl. Polymer Sci., vol. 126, no. S2, Nov. 25, 2012, pp. 108-115.
K.P. Pang and J.K. Gillham, "Competition between Cure and Thermal Degradation in a High Tg Epoxy System: Effect of Time and Temperature of Isothermal Cure on the Glass Transition Temperature," J. Appl. Polymer Sci., vol. 39, no. 4, Feb. 20, 1990, pp. 909-933.
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