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NTIS 바로가기大韓機械學會論文集. Transactions of the Korean Society of Mechanical Engineers. B. B, v.42 no.7 = no.394, 2018년, pp.475 - 478
In this paper, a fabrication process that utilizes both photoresist (PR) and silicon oxide layer etch masks for deep reactive ion etching (DRIE) is presented for manufacturing high-aspect-ratio silicon structures without severe residual stress. An oxide layer was first deposited, and only the critic...
Wu, B., Kumar, A. and Pamarthy, S., 2010, "High Aspect Ratio Silicon Etch: A Review," Journal of Applied Physics, 108, 051101.
Laermer, F. and Schilp, A., 1993, Method of Anisotropically Etching Silicon, US Patent, US 5,501,983 A.
MicroChemicals GmbH, 2010, "Dry Etching with Photoresist Masks," Website: http://www.microchemicals.eu/ technical_information
Park, U., Rhim, J., Jeon, J. U. and Kim, J., 2014, "A Micromachined Differential Resonant Accelerometer Based on Robust Structural Design," Microelectronic Engineering, Vol. 129, pp. 5-11.
Park, U., An, J. E. and Yoon, S., 2017, "Improvement of Bonding Strength Uniformity in Silicon-on-glass Process by Anchor Design," Trans. Korean Soc. Mech. Eng. B, Vol. 41, No. 6, pp. 423-427.
Harz, M. and Engelke, H., 1996, "Curvature Changing or Flattening of Anodically Bonded Silicon and Borosilicate Glass," Sensors and Actuators A, Vol. 55, pp. 201-209.
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