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NTIS 바로가기ETRI journal, v.41 no.6, 2019년, pp.820 - 828
Eom, Yong-Sung (ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute) , Jang, Keon-Soo (ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute) , Son, Ji-Hye (ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute) , Bae, Hyun-Cheol (ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute) , Choi, Kwang-Seong (ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute)
A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For ...
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Y. S. Eom et al., Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder, Microelectron. Eng. 85 (2008), 2202-2206.
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Catalogue, adhesion strength, model: Loctite Ablestick SSP2020, Henkel, 2014.
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