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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.27 no.4, 2020년, pp.1 - 10
강민규 (서울과학기술대학교 기계시스템디자인공학과) , 김성동 (서울과학기술대학교 기계시스템디자인공학과)
This paper reviews the recent development of electronic textile technology, mainly focusing on chip-textile bonding. Before the chip-textile bonding, a circuit on the textile should be prepared to supply the electrical power and signal to the chip mounted on the fabrics. Either embroidery with condu...
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S. K. Park and W. K. Kim, "Electronics and Smart Textiles", Polymer Science and Technology, 24(1), 38 (2013).
W. Zeng, L. Shu, Q. Li, S. Chen, F. Wang, and X. M. Tao, "Fiber-Based Wearable Electronics: A Review of Materials, Fabrication, Devices, and Applications", Adv. Mater., 26, 5310 (2014).
M. Yang, J. Pan, A. Xu, L. Luo, D. Cheng, G. Cai, J. Wang, B, Tang, and X. Wang, "Conductive Cotton Fabrics for Motion Sensing and Heating Applications", Polymers, 10, 568 (2018).
H. J. Kim, "Commercialization of Conductive Yarn and Fabrics", Fiber Technology and Industry, 22(3), 210 (2018).
J. Lee, H. Kwon, J. Seo, S. Shin, J. H. Koo, C. Pang, S. Son, J. H. Kim, Y. H. Jang, D. E. Kim, and T. Lee, "Conductive Fiber-Based Ultrasensitive Textile Pressure Sensor for Wearable Electronics", Adv. Mater., 27, 2433 (2015).
S. S. Yoon, K. E. Lee, H. J. Cha, D. G. Seong, M. K. Um, J. H. Byun, Y. Oh, J. H. Oh, W. Lee, and J. U. Lee, "Highly Conductive Graphene/Ag Hybrid Fibers for Flexible Fiber-Type Transistors", Sci. Rep., 5, 16366 (2015).
A. Sumboja, J. Liu, W. G. Zheng, Y. Zong, H. Zhang, and Z. Liu, "Electrochemical energy storage devices for wearable technology: a rationale for materials selection and cell design", Chem. Soc. Rev., 47, 5919 (2018).
D. A. Hardy, I. Anastasopoulos, M.-N. Nashed, C. Oliveira, T. Hughes-Riley, A. Komolafe, J. Tudor, R. Torah, S. Beeby, and T. Dias, "Automated insertion of package dies onto wire and into a textile yarn sheath", Microsystem Technologies, 1 (2019).
J. Liang, K. Tong, and Q. Pei, "A Water-Based Silver-Nanowire Screen-Print Ink for the Fabrication of Stretchable Conductors and Wearable Thin-Film Transistors", Adv. Mater., 28, 5986 (2016).
W. Wu, "Stretchable electronics: functional materials, fabrication strategies and applications", Science and Technology of Advanced Materials, 20(1), 187 (2019).
M. Jablonski, F. Bossuyt, J. Vanfleteren, T. Vervust, and H. de Vries, "Reliability of a stretchable interconnect utilizing terminated, in-plane meandered copper conductor", Microelectronics Reliability, 53, 956 (2013).
N. Matsuhisa, M. Kaltenbrunner, T. Yokota, H. Jinno, K. Kuribara, T. Sekitani, and T. Someya, "Printable elastic conductors with a high conductivity for electronic textile applications", Nat. Commun., 6, 7461 (2015).
I. Kazani, C. Hertleer, A. Schwarz-Pfeiffer, and G. Guxho, "Electrical Conductive Textiles Obtained by Screen Printing", Fibres & Textiles in Eastern Europe, 20(1), 57 (2012).
O. Ojuroye, R. Torah, and S. Beeby, "Modified PDMS packaging of sensory e-textile circuit microsystems for improved robustness with washing", Microsystem Technologies, 1 (2019).
S. Schneegass and O. Amft, "Smart Textiles", Springer (2017).
X. Lin, B.-C. Seet, and F. Joseph, "Fine-pitch surface component mounting on screen-printed fabric circuits", Electron. Lett., 52(16), 1032 (2016).
M. E. Berglund, "Delocalizing Strain in an Interconnected Joint on a Textile Substrate", Proc. ACM International Joint Conference and 2018 International Symposium on Pervasive and Ubiquitous Computing and Wearable Computers, 571 (2018).
S.-Y. Jung, H. E. Hong, and K.-W. Paik, "A Study on the Curod Anisotropic Conductive Films (ACFs) for Flex-on-Fabric (FOF) Interconnections using an Ultrasonic Bonding Method", Proc. 66th Electronic Components and Technology Conference, 2245, IEEE (2016).
T. Linz, M. von Krshiwoblozki, H. Walter, and P. Foerster, "Contacting electronics to fabric circuits with nonconductive adhesive bonding", The Journal of The Textile Institute, 103(10), 1139 (2012).
T. Linz, "Analysis of Failure Mechanisms of Machine Embroidered Electrical Contacts and Solutions for Improved Reliability", in Ph.D. Thesis, pp.188, Ghent University, Ghent, Belgium (2011).
E. P. Simon, C. Kallmayer, M. Schneider-Ramelow, and K. D. Lang, "Development of a Multi-Terminal Crimp Package for Smart Textile Integration", Proc. 4th Electronic System-Integration Technology Conference (ESTC), Amsterdam, Netherlands, 1, IEEE (2012).
T. Linz, C. Kallmayer, R. Aschenbrenner, and H. Reichl, "New interconnection technologies for the integration of electronics on textile substrates", Proc. International Scientific Conference on Intelligent Ambience and Well-Being, 19 (2005).
T. Vervust, G. Buyle, F. Bossuyt, and J. Vanfleteren, "Integration of stretchable and washable electronic modules for smart textile applications", Journal of The Textile Institute, 103(10), 1127 (2012).
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X. Righetti and D. Thalmann, "Proposition of a modular I2C-based wearable architecture", Proc. 15th Mediterranean Electrotechnical Conference (MELECON), Valletta, Malta, 802, IEEE (2010).
H. Ohno, F. Narui, and S. Hayashi, "Zipper-type electrical connector", Patent US5499927A (1996).
J. Y. Park, "IEC Standardization trend of Smart Wearable Devices", The Magazine of the IEIE, 45(12), 16 (2018).
H. J. Koo and K. M. Lee, "Standardization Trend of E-textiles", The Magazine of the IEIE, 45(12), 37 (2018).
G. De Pasquale and A. Mura, "Accelerated lifetime tests on e-textiles: Design and Fabrication of Multifunctional Test Bench", Journal of Industrial Textiles, 47(8), 1925 (2018).
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