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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.27 no.2, 2020년, pp.53 - 58
박근서 (한양대학교 기술경영전문대학원) , 최경현 (한양대학교 기술경영전문대학원)
Analysis of electric semiconductor packaging technology for electric vehicles was performed. Topic modeling using LDA technique was performed by collecting valid patents by deriving valid patents. It was classified into 20 topics, and the definition of technology was defined through extracted words ...
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