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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.28 no.4, 2021년, pp.109 - 114
최동훈 (서울과학기술대학교 기계시스템디자인공학과) , 한승은 (서울과학기술대학교 기계시스템디자인공학과) , 추혁진 (서울과학기술대학교 기계시스템디자인공학과) , 김인주 (서울과학기술대학교 기계시스템디자인공학과) , 김성동 (서울과학기술대학교 기계시스템디자인공학과)
We investigated the effects of atmospheric hydrogen plasma treatment on Cu-Cu direct bonding. Hydrogen plasma was effective in reducing the surface oxide layer of Cu thin film, which was confirmed by GIXRD analysis. It was observed that larger plasma input power and longer treatment time were effect...
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