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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.28 no.2, 2021년, pp.89 - 94
손민정 (한국생산기술연구원 부품기능연구부문 마이크로조이닝센터) , 김민수 (한국생산기술연구원 부품기능연구부문 마이크로조이닝센터) , 주병권 (고려대학교 전기전자공학부 디스플레이 및 나노시스템 연구실) , 이태익 (한국생산기술연구원 부품기능연구부문 마이크로조이닝센터)
The mechanical reliability of flexible devices has become a major concern on their commercialization, where the importance of reliable bonding is highlighted. In terms of component materials' properties, it is important to consider thermal damage of polymer substrates that occupy large area of the f...
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