최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.29 no.4, 2022년, pp.77 - 82
이서향 (홍익대학교 신소재공학과) , 이재호 (홍익대학교 신소재공학과)
During etching process of PCB, the electroplated copper line and seed layer copper have different etching rates and it caused the over etching of copper line as well as undercut of lines. In this research, the effects of etchants composition on copper etching characteristics were investigated. The o...
R. Schwerz, B. Boehme, M. Roellig, K. J. Wolter, and N. Meyendorf, "Reliability of embedding concepts for discrete passive components in organic circuit boards", Proc. 63rd Electronic Components and Technology Conference(ECTC), Las Vegas, 1243-1251, IEEE Components, Packaging and Manufacturing Technology Society(CPMT) (2013).
O. J. Kwon, S. K. Cho, and J. J. Kim, "Electrochemical metallization processes for copper and silver metal interconnection" Kor. Chem. Eng. Res., 47(2), 141-149 (2009).
K. H. Dietz, "Challenges and limitations of subtractive processing in PWB and substrate fabrication", Proc. 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference(IMPACT), Taipei, 231-234, IEEE Components, Packaging and Manufacturing Technology Society(CPMT) (2008).
H. S. Shin, "Fabrication of multilayered structures in electrochemical etching using a copper protective layer", J. Korean Soc. Manuf. Process Eng., 18(2), 38-43 (2019).
F. Vasilyev, V. Isaev, and M. Korobkov, "The influence of the PCB design and the process of their manufacturing on the possibility of a defect-free production", Przegl. Elektrotech., 97(3), 91-96 (2021).
Y. J. Kang, M. E. Hong, and D. H. Kim, "Study on soft etching material development to improve peel strength between surface of copper and solder resist ink", Appl. Chem. Eng., 20(2), 172-176 (2009).
L. Jiang, Y. Lan, Y. He, Y. Li, Y. Li, and J. Luo, "1, 2, 4-triazole as a corrosion inhibitor in copper chemical mechanical polishing", Thin Solid Films, 556, 395-404 (2014).
N. K. Allam, A. A. Nazeer, and E. A. Ashour, "A review of the effects of benzotriazole on the corrosion of copper and copper alloys in clean and polluted environments", J. Appl. Electrochem., 39(7), 961-969 (2009).
J. W. Lee, M. C. Kang, and J. J. Kim, "Characterization of 5-Aminotetrazol as a corrosion inhibitor in copper chemical mechanical polishing", J. Electrochem. Soc., 152(12), C872-C831 (2005).
S. Lee and S. J. Moon, "Preparation of soft etchant to improve adhesion strength between photoresist and copper layer in copper clad laminates", J. Kor. Appl. Sci. and Technol., 32(3), 512-521 (2015).
J. H. Lee, "PCB quality and reliability affected by galvanic reaction" Proceedings of the Korean Institute of Surface Engineering Conference, 38-56, Kor. Inst. Surf. Eng. (2012)
S. W. Lee and J. J. Kim, "Study on the effects of corrosion inhibitor according to the functional groups for Cu chemical mechanical polishing in neutral environment", Kor. Chem. Eng. Res., 53(4), 517-523 (2015).
H. R. Yoo and Y. D. Son, "A study on safety management and control in wet-etching process for H 2 O 2 reactions", J. of Kor. Academia-Industrial, 19(4), 650-656 (2018).
T. G. Woo, I. S. Park, and K. W. Seol, "Main effects of plating parameters on mechanical and surface properties of electroplated copper" Kor. J. Met. Mater., 56(6), 459-464 (2018).
D. A. Jones, Principles and Prevention of Corrosion, pp.168-196, New York, Macmillan Publishing Co. (1995)
*원문 PDF 파일 및 링크정보가 존재하지 않을 경우 KISTI DDS 시스템에서 제공하는 원문복사서비스를 사용할 수 있습니다.
오픈액세스 학술지에 출판된 논문
※ AI-Helper는 부적절한 답변을 할 수 있습니다.