[논문]저융점 Sn-Bi 솔더의 신뢰성 개선 연구

정민성; 김현태; 윤정원

doi:10.6117/kmeps.2022.29.2.001

저융점 Sn-Bi 솔더의 신뢰성 개선 연구
Improvement of Reliability of Low-melting Temperature Sn-Bi Solder 원문보기

마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.29 no.2, 2022년, pp.1 - 10

정민성 (충북대학교 신소재공학과) , 김현태 (충북대학교 신소재공학과) , 윤정원 (충북대학교 신소재공학과)

초록
AI-Helper

최근 반도체 소자는 모바일 전자제품과 wearable 및 flexible한 소자와 기판의 다양한 활용으로 많은 분야에서 폭넓게 사용되고 있다. 이들 반도체 칩 접합 공정 중 기판과 솔더의 열팽창 계수(CTE)의 차이와 기판 및 부품 전체에 인가되는 과도한 열 영향은 소자의 성능 및 신뢰성에 영향을 주며, 최종적으로 휨(warpage) 현상 및 장기 신뢰성 저하 등을 초래한다. 이러한 문제점을 개선하기 위해 저온에서 공정이 가능한 저융점 솔더에 대한 연구가 활발히 진행되고 있다. Sn-Bi, Sn-In 등 다양한 저융점 솔더 합금 중 Sn-Bi 솔더는 높은 항복 강도, 적절한 기계적 특성 및 저렴한 가격 등의 이점이 있어 유망한 저온 솔더로 각광받고 있다. 그러나 Bi의 높은 취성 특성 등 단점으로 인해 솔더 합금의 개선이 필요하다. 본 review 논문에서는 다양한 미량 원소와 입자를 첨가하여 Sn-Bi 소재의 기계적 특성 개선을 위한 연구 동향을 소개하며 이를 비교 분석하였다.

Abstract ▼ AI-Helper

Recently, semiconductor devices have been used in many fields owing to various applications of mobile electronics, wearable and flexible devices and substrates. During the semiconductor chip bonding process, the mismatch of coefficient of therm al expansion (CTE) between the substrate and the solder, and the excessive heat applied to the entire substrate and components affect the performance and reliability of the device. These problems can cause warpage and deterioration of long-term reliability of the electronic packages. In order to improve these issues, many studies on low-melting temperature solders, which is capable of performing a low-temperature process, have been actively conducted. Among the various low-melting temperature solders, such as Sn-Bi and Sn-In, Sn-58Bi solder is attracting attention as a promising low-temperature solder because of its advantages such as high yield strength, moderate mechanical property, and low cost. However, due to the high brittleness of Bi, improvement of the Sn-Bi solder is needed. In this review paper, recent research trends to improve the mechanical properties of Sn-Bi solder by adding trace elements or particles were introduced and compared.

주제어

표/그림 (13)

그림 Fig. 1. Thermal stress due to CTE mismatch during high-temperature soldering process.
그림 Fig. 2. Tensile strength of solder joints after aging for different times.³³⁾
그림 Fig. 3. Shear strength of the Sn-58Bi-based solder joints.³⁴⁾
그림 Fig. 4. Tensile strength and elongation of (a) Sn-(58-x)Bi-xCu alloys and (b) Sn-(58-x)Bi-xP alloys.³⁵⁾
그림 Fig. 5. (a) Spreading area and (b) shear strength with addition of Ti nanoparticles.⁴²⁾
$Fig. 6. (a) Shear strength of Sn-58Bi-xRu solder joints, (b) fractured surface of Sn-58Bi-0.2Ru/Cu OSP solder joint, and (c) fractured surface of Sn-58Bi-0.2Ru/ENIG solder joint.<sup>44)</sup>$ 그림 Fig. 6. (a) Shear strength of Sn-58Bi-xRu solder joints, (b) fractured surface of Sn-58Bi-0.2Ru/Cu OSP solder joint, and (c) fractured surface of Sn-58Bi-0.2Ru/ENIG solder joint.⁴⁴⁾
그림 Fig. 7. Ball shear strength of Ag-free and Ag-containing Sn58Bi BGA solder joints with Cu pads after liquid reaction for various times.⁴⁵⁾
그림 Fig. 8. (a) Load-penetration curves in indentation tests with different nanoparticle concentrations, (b) Change of penetration depth over the dwell time under a peak load of 20 mN, (c) Change of creep strain rate at different weight percentages of Cu₆Sn₅ nanoparticle, (d) The creep stress exponent of various composite solder alloys.⁴⁷⁾
그림 Fig. 9. Microstructure of Sn-Bi solder and Sn-Bi composite solders; (a) Sn-Bi, (b) Sn-Bi + 0.07wt% Graphite, (c) Sn–Bi + 0.14wt% Graphite, (d) Sn-Bi + 0.3wt% Graphite, and (e) Sn-Bi + 0.6wt% Graphite.⁵⁰⁾
그림 Fig. 10. Effect of nanosized graphite on the UTS and Elongation of Sn-Bi solder and its composite solders joints.⁵⁰⁾
그림 Fig. 11. Simulation results of tensile test for the stress distribution in the (a) SnBi solder joint, (b) SnBi-0.05CNT solder joint, and (c) SnBi-0.2CNT solder joint.⁵¹⁾
그림 Fig. 12. SEM morphologies and IMC layer thickness of (a) Sn-58Bi, (b) Sn-58Bi + 1% ZrO₂, (c) Sn-58Bi + 2% ZrO₂, and (d) Sn-58Bi + 3% ZrO₂ solder joints.⁵²⁾
그림 Fig. 13. (a) Engineering stress-strain curves of Sn58Bi-xAl₂O₃ solder slabs (x = 0, 0.5, 1.0, 1.5), (b) UTS and elongation of solder specimens.⁵³⁾

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