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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.30 no.3, 2023년, pp.40 - 50
김기풍 (서울과학기술대학교 나노IT융합공학과) , 황보유환 (서울과학기술대학교 나노IT융합공학과) , 좌성훈 (서울과학기술대학교 지능형반도체공학과)
Recently, the number of components of smartphones increases rapidly, while the PCB size continuously decreases. Therefore, 3D technology with a stacked PCB has been developed to improve component density in smartphone. For the s tacked PCB, it i s very important to obtain solder bonding quality betw...
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