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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.29 no.3, 2022년, pp.63 - 71
전소연 (한국생산기술연구원 마이크로조이닝센터 접합적층연구부문) , 권상현 (한국생산기술연구원 마이크로조이닝센터 접합적층연구부문) , 이태영 (한국생산기술연구원 마이크로조이닝센터 접합적층연구부문) , 한덕곤 ((주)엠케이켐앤텍 기업부설연구소) , 김민수 (한국생산기술연구원 마이크로조이닝센터 접합적층연구부문) , 방정환 (한국생산기술연구원 마이크로조이닝센터 접합적층연구부문) , 유세훈 (한국생산기술연구원 마이크로조이닝센터 접합적층연구부문)
In this study, the interfacial reaction and drop impact reliability of Sn-Ag-Cu (SAC) solder and electroless nickel autocatalytic gold (ENAG) were studied. In addition, the solder joint properties with the ENAG surface finish was compared with electroless nickel immersion gold (ENIG) and electroless...
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