참고문헌 (14)

1. M. Eritt, C. May, K. Leo, M. Toerker, and C. Radehaus,？"OLED manufacturing for large area lighting applications", Thin solid films, Vol. 518, no.11, pp. 3042-？3045, 2010.？ 

   상세보기

2. D.H. Kim, and K. S. Kim, "Study on Coolant Passage？for Improving Temperature Uniformity of the Electrostatic Chuck Surface", Journal of the semiconductor？& display technology, Vol. 15, no. 3, pp. 72-77, 2016.？ 

3. A. Johnsen and K. Rahbek, "A physical phenomenon？and its applications to telegraphy, telephony, etc",？Journal of the Institution of Electrical Engineers, Vol. 61,？no. 320, pp. 713-725, 1923.？ 

   상세보기

4. J. Guo, J. Leng and J. Rossiter, "Electroadhesion technologies for robotics: A comprehensive review", IEEE？Transactions on Robotics, Vol. 36, no. 2, pp. 313-327,？2019.？ 

5. J. Guo, T. Bamber, M. Chamberlain, L. Justham, and M.？Jackson, "Optimization and experimental verification of？coplanar interdigital electroadhesives", Journal of？Physics D: Applied Physics, Vol. 49, no. 41, 2016.？ 

6. H. Prahlad, R. Pelrine, S. Stanford, J. Marlow, and R.？Kornbluh, "Electroadhesive robots-wall climbing robots enabled by a novel, robust, and electrically controllable adhesion technology", IEEE international？conference on robotics and automation, pp. 3028-3033,？2008.？ 

7. K. Choi, J. Y. Chung, I. K. Park, N. Y. Kim, J. Suhr, and？J. D. Nam, "Capturing Polar and Nonpolar Particles？with an Electroadhesive Device Using Interfacial and？Orientational Polarization", ACS Sustainable Chemistry？& Engineering, Vol. 9, no. 39, pp. 13367-13375, 2021.？ 

   상세보기

8. M. Ritter, and D. Barnhart, "Geometry characterization？of electroadhesion samples for spacecraft docking？application", IEEE Aerospace Conference, pp. 1-8, 2017.？ 

9. B. C. Leung, N. R. Goeser, L. A. Miller, and S.？Gonzalez, "Validation of electroadhesion as a docking？method for spacecraft and satellite servicing", IEEE？Aerospace Conference, pp. 1-8, 2015.？ 

10. K. Yatsuzuka, J. I. Toukairin, K. Asano, and S. Aonuma,？"Electrostatic chuck with a thin ceramic insulation layer？for wafer holding", In Conference Record of the 2001？IEEE Industry Applications Conference. 36th IAS？Annual Meeting (Cat. No. 01CH37248), Vol. 1, pp. 399-40, 2001.？ 

11. C. H. Li, Y. F. Chiu, Y. H. Yu, and J. Z. Chen,？"Simulation studies on bipolar electrostatic chucks", In？2015 10th International Microsystems, Packaging,？Assembly and Circuits Technology Conference？(IMPACT), pp. 382-385, 2015.？ 

12. J. Y. Lee, K. M. Jang, D. K. Min, J. G. Kang, G. H.？Sung, and H. D. Kim, "A Study on Attractive Force Characteristics of Glass Substrate Using Alumina？Electrostatic Chuck by Finite Element Analysis",？Journal of the Semiconductor & Display Technology,？Vol. 19, no. 4, pp. 45-50, 2020.？ 

13. J. Yoo, J. S. Choi, S. J. Hong, T. H. Kim, and S. J. Lee,？"Finite element analysis of the attractive force on a？Coulomb type electrostatic chuck", International Conference on Electrical Machines and Systems (ICEMS),？pp. 1371-1375, 2007.？ 

14. H.S. Choi, I.H. Park, and W.K. Moon, "On the physical？meaning of maxwell stress tensor", The Transactions of？The Korean Institute of Electrical Engineers, Vol. 58, no.？4, pp. 725-734, 2009.？