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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.30 no.3, 2023년, pp.73 - 77
공석헌 (서울과학기술대학교) , 김준형 (서울과학기술대학교) , 홍슬기 (서울과학기술대학교)
In this study, we developed a Multi-level FeRAM (Ferroelectrics random access memory) device utilizing different ferroelectric materials and analyzed its operation through C-V analysis using simulations. To achieve Multi-level operation, we proposed an MFM (Multi-Ferroelectric Material) structure by...
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