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NTIS 바로가기Materials Research Society symposia proceedings, v.970, 2006년, pp.0970-Y04-08 -
Matthias, Thorsten , Wimplinger, Markus , Pargfrieder, Stefan , Lindner, Paul
ABSTRACTMany feasibility and design studies during the last years have shown that devices based on 3D chip stacking and integration can significantly outperform traditional planar (2D) devices. Furthermore, as packaging of the devices is a major cost factor, the possibility to integrate multiple fun...
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