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Micro and nano systems letters, v.8 no.1, 2020년, pp.14 -
Park, Jin Soo , Kang, Dong-Hyun , Kwak, Seung Min , Kim, Tae Song , Park, Jung Ho , Kim, Tae Geun , Baek, Seung-Hyub , Lee, Byung Chul
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AbstractDeep reactive-ion etching (DRIE) is commonly used for high aspect ratio silicon micromachining. However, scalloping, which is the result of the alternating Bosch process of DRIE, can cause many problems in the subsequent process and degrade device performance. In this work, we propose a simp...
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