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NTIS 바로가기Journal of micromechanics and microengineering.: structures, devices, and systems, v.22 no.7, 2012년, pp.075013 -
Ham, Y-H , Kim, D-P , Baek, K-H , Park, K-S , Kwon, K-H , Do, L-M
We investigated a metal filling and liner formation mechanism with a nano-Ag particle for the blind Si via, which is used in the via first process of through silicon via (TSV) interconnection. Using the deep reactive ion etching process, we produced the blind Si via (which is called the blind via ho...
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