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NTIS 바로가기Journal of materials processing technology, v.140 no.1/3, 2003년, pp.280 - 286
Lee, Shuo-Jen (Corresponding author.) , Lee, Yu-Ming (Department of Mechanical Engineering, Yuan Ze University, Chung-Li, Taiwan, ROC) , Du, Ming-Feng (Department of Mechanical Engineering, Yuan Ze University, Chung-Li, Taiwan, ROC)
Abstract In this paper, the polishing mechanism of the electrochemical mechanical polishing (ECMP) technology for tooling steel SKD11 was investigated. Suitable electrochemical process parameters were evaluated. The electrochemical characteristics of a material such as active, passive and tran...
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