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NTIS 바로가기IEEE transactions on components, packaging, and manufacturing technology, v.4 no.7, 2014년, pp.1131 - 1135
Hyun-Su Choi (Dept. of Display Eng., Hoseo Univ., Asan, South Korea) , Hye-Kyung Kwon (Dept. of Display Eng., Hoseo Univ., Asan, South Korea) , Keun-Soo Kim (Dept. of Display Eng., Hoseo Univ., Asan, South Korea) , Joon-Sik Park (Dept. of Mater. Sci. & Eng., Hanbat Nat. Univ., Daejeon, South Korea) , Choel-Hee Moon (Dept. of Display Eng., Hoseo Univ., Asan, South Korea)
An encapsulation method using the separation of low melting point alloy (LMPA) and a polymer from an LMPA-polymer mixture is proposed. Sn-Bi alloy and epoxy were used for the mixture. Separation was conducted using a two-step heat treatment of 160 °C for 5 min and 180 °C for 5 min. We ...
Wong, F. L., Fung, M. K., Tao, S. L., Lai, S. L., Tsang, W. M., Kong, K. H., Choy, W. M., Lee, C. S., Lee, S. T.. Long-lifetime thin-film encapsulated organic light-emitting diodes. Journal of applied physics, vol.104, no.1, 014509-.
Chwang, Anna B., Rothman, Mark A., Mao, Sokhanno Y., Hewitt, Richard H., Weaver, Michael S., Silvernail, Jeff A., Rajan, Kamala, Hack, Michael, Brown, Julie J., Chu, Xi, Moro, Lorenza, Krajewski, Todd, Rutherford, Nicole. Thin film encapsulated flexible organic electroluminescent displays. Applied physics letters, vol.83, no.3, 413-415.
Yim, Byung-Seung, Kim, Jong-Min, Jeon, Sung-Ho, Lee, Seong Hyuk, Kim, Jooheon, Han, Jung-Geun, Eom, Yong-Sung, Shin, Young-Eui. Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive). Materials transactions, vol.50, no.7, 1684-1689.
Park, Jongwoon, Ham, Hyokyun, Park, Cheolyoung. Heat transfer property of thin-film encapsulation for OLEDs. Organic electronics, vol.12, no.2, 227-233.
Eom, Yong-Sung, Jang, Keonsoo, Moon, Jong-Tae, Nam, Jae-Do, Kim, Jong-Min. Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder. Microelectronic engineering, vol.85, no.11, 2202-2206.
Appl Phys Lett Encapsulation of organic light-emitting devices using a perfluorinated polymer granstrom 1933 93
Kim, Jong-Min, Yasuda, Kiyokazu, Rito, Masahiro, Fujimoto, Kozo. New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers. Materials transactions, vol.45, no.1, 157-160.
Yim, B.S., Kwon, Y., Oh, S.H., Kim, J., Shin, Y.E., Lee, S.H., Kim, J.M.. Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging. Microelectronics reliability, vol.52, no.6, 1165-1173.
Lee, Y.G., Choi, Y.H., Kee, I.S., Shim, H.S., Jin, Y., Lee, S., Koh, K.H., Lee, S.. Thin-film encapsulation of top-emission organic light-emitting devices with polyurea/Al2O3 hybrid multi-layers. Organic electronics, vol.10, no.7, 1352-1355.
Eom, Y.S., Baek, J.W., Moon, J.T., Nam, J.D., Kim, J.M.. Characterization of polymer matrix and low melting point solder for anisotropic conductive film. Microelectronic engineering, vol.85, no.2, 327-331.
Ham, H., Park, J., Kim, Y.. Thermal and barrier properties of liquid getter-filled encapsulations for OLEDs. Organic electronics, vol.12, no.12, 2174-2179.
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