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Proceedings of the Institution of Mechanical Engineers. Part B, Journal of engineering manufacture, v.227 no.4, 2013년, pp.578 - 586
Gao, Shang , Dong, Zhigang , Kang, Renke , Guo, Dongming
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The objective of this study is to design and evaluate soft abrasive wheels for silicon wafer grinding. In this study, CeO2, SiO2, Fe2O3 and MgO soft abrasives are used in the design of soft abrasive grinding wheels. The soft abrasive grinding wheels are then used to grind silicon wafers and compared...
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