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NTIS 바로가기IEEE transactions on electron devices, v.62 no.7, 2015년, pp.2071 - 2077
Chenyun Pan , Baert, Rogier , Ciofi, Ivan , Tokei, Zsolt , Naeemi, Azad
This paper analyzes the impact of the interconnect variation at the system level in terms of clock frequency based on a fast and efficient system-level variation-aware design methodology. Various types of interconnect variations are compared, such as the critical dimension for line/core and spacer, ...
RAPHAEL Interconnect Analysis Program 1996
Pan, Chenyun, Naeemi, Azad. A Fast System-Level Design Methodology for Heterogeneous Multi-Core Processors Using Emerging Technologies. IEEE journal on emerging and selected topics in circuits and systems, vol.5, no.1, 75-87.
Chenyun Pan, Naeemi, Azad. A Proposal for a Novel Hybrid Interconnect Technology for the End of Roadmap. IEEE electron device letters : a publication of the IEEE Electron Devices Society, vol.35, no.2, 250-252.
Predictive Technology Model (PTM) 2012
International Technology Roadmap for Semiconductors (ITRS) 2012
Proc SPIE Design Manufacturability Design-Process Integr IV Decomposition strategies for self-aligned double patterning ma 2010 7641 76410t-1
Demuynck, Steven, Huffman, Craig, Claes, Martine, Suhard, Samuel, Versluijs, Janko, Volders, Henny, Heylen, Nancy, Kellens, Kristof, Croes, Kristof, Struyf, Herbert, Vereecke, Guy, Verdonck, Patrick, Roest, David De, Beynet, Julien, Sprey, Hessel, Beyer, Gerald P.. Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora® LK HM. Japanese journal of applied physics, vol.49, no.4, 04DB05-.
Proc SPIE Optical Microlithography XXI Sidewall spacer quadruple patterning for 15 nm half-pitch xu 2011 7973 79731q-1
Proc IEEE Int Interconnect Technol Conf (IITC) 48 nm pitch cu dual-damascene interconnects using self aligned double patterning scheme chen 2013 1
Proc IEEE Int Interconnect Technol Conf (IITC) Impact of advanced patterning options, 193 nm and EUV, on local interconnect performance stucchi 2012 1
Chern, J.-H., Huang, J., Arledge, L., Li, P.-C., Yang, P.. Multilevel metal capacitance models for CAD design synthesis systems. IEEE electron device letters : a publication of the IEEE Electron Devices Society, vol.13, no.1, 32-34.
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