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NTIS 바로가기IEEE transactions on computers, v.67 no.1, 2018년, pp.32 - 44
Shin, Ho Hyun (Samsung Electronics Company, Ltd., Hwasung, Korea) , Park, Young Min (School of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea) , Choi, Duheon (School of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea) , Kim, Byoung Jin (School of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea) , Cho, Dae-Hyung (School of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea) , Chung, Eui-Young (School of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea)
For future exascale computing systems, ultra-high-density memories would be required that consume low power to process massive data. Of the various memory devices, 3D-stacked DRAMs using TSVs are a perfect solution for this purposes. In addition to providing high capacity, these provide functional f...
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