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NTIS 바로가기Micro and nano systems letters, v.5 no.1, 2017년, pp. -
Kim, Kyongtae , Kwon, Hong-Beom , Ahn, Hye-Rin , Kim, Yong-Jun
초록이 없습니다.
J Microelectromech Syst F Wang 18 933 2009 10.1109/JMEMS.2009.2021815 Wang F, Cheng R, Li X (2009) MEMS vertical probe cards with ultra densely arrayed metal probes for wafer-level IC testing. J Microelectromech Syst 18:933–941
Microsyst Technol WC Choi 18 333 2012 10.1007/s00542-012-1445-9 Choi WC, Ryu JY (2012) Fabrication of a guide block for measuring a device with fine pitch area-arrayed solder bumps. Microsyst Technol 18:333–339
J Micromech Microeng BH Kim 17 1350 2007 10.1088/0960-1317/17/7/018 Kim BH, Kim HC, Choi SD, Chun K, Kim JB, Kim JH (2007) A robust MEMS probe card with vertical guide for a fine pitch test. J Micromech Microeng 17:1350–1359
Sens Actuators A Phys T Yuan 204 67 2013 10.1016/j.sna.2013.10.004 Yuan T, Chen D, Chen J, Fu H, Kurth S, Otto T, Gessner T (2013) Design, fabrication and characterization of MEMS probe card for fine pitch IC testing. Sens Actuators A Phys 204:67–73
J Micromech Microeng BH Kim 18 075031 2009 10.1088/0960-1317/18/7/075031 Kim BH, Kim JB (2009) Design and fabrication of a highly manufacturable MEMS probe card for high speed testing. J Micromech Microeng 18:075031
Sens Actuators A Phys BH Kim 152 252 2009 10.1016/j.sna.2009.03.022 Kim BH, Park BJ, Kim JB (2009) Process effects of double step DRIE and Ni–Co electroplating for a trench-type cantilever probe for a fine-pitched MEMS probe card. Sens Actuators A Phys 152:252–260
Microelectron Eng KY Lee 113 147 2014 10.1016/j.mee.2013.07.023 Lee KY, Huang JT, Chao PS, Lin JM, Hsu HJ (2014) An integrated electroless nickel plating process for fabrication of CMOS-MEMS probe chip. Microelectron Eng 113:147–151
J Appl Phys BH Kim 51 06FL16 2012 10.7567/JJAP.51.06FL16 Kim BH, Cho C, Lee B, Kim HC, Chun K (2012) Design and fabrication of microelectromechanical systems probe card with vertical trench guide for fine pitch probing. J Appl Phys 51:06FL16
Kim JH, Chu SI, Seo HW, Ryu JW, Kim GT, Moon S (2007) Fabrication and characteristics of MEMS vertical type probe tip for micro sized pads measurement. In: 20th International conference on micro electro mechanical systems. IEEE, Hyogo, 21–25 Jan 2007, pp 283–286
Acta Mater WM Yin 53 383 2005 10.1016/j.actamat.2004.09.034 Yin WM, Whang SH, Mirshams RA (2005) Effect of interstitials on tensile strength and creep in nanostructured Ni. Acta Mater 53:383–392
I&EC Res C Domínguez-Ríos 51 7762 2012 Domínguez-Ríos C, Hurtado-Macias A, Torres-Sánchez R, Ramos MA, González-Hernández J (2012) Measurement of mechanical properties of an electroless Ni–B coating using nanoindentation. I&EC Res 51:7762–7768
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