[논문]Fine pitch features laser direct patterning on flexible printed circuit board

Dupont, F.; Stoukatch, S.; Laurent, P.; Redouté; , J.M.

doi:10.1016/j.optlaseng.2019.105869

[해외논문] Fine pitch features laser direct patterning on flexible printed circuit board

Optics and lasers in engineering, v.126, 2020년, pp.105869 -

Dupont, F. (Corresponding author.) , Stoukatch, S. , Laurent, P. , Redouté, J.M.

Abstract ▼ AI-Helper

Abstract Laser direct copper patterning of fine pitch features on polyimide flexible substrate was investigated. On such thin substrates (generally below 0.1 mm), laser parameters should be optimized in order to minimize the damage beneath the conductive layer, as it might lead to severe robustness issues. We selected several parameter sets and compared them in terms of damage depth, feature sizes and edge straightness. On bare copper PCBs (Printed Circuit Boards), we managed to limit the average damage to a depth of 8 µm, while getting features’ characteristics significantly better than what would be obtained with standard chemical etching. We also demonstrated alternative parameter sets that allow to obtain ultra-thin features or very straight edges at the cost of deeper damage in the substrate. Two application cases were studied. Firstly, we realized 2D planar coils. Due to a higher number of turns at equivalent surface areas, laser patterning of a spiral coil results in inductance value one order of magnitude larger when compared with standard chemical etching (39 µH vs. 4 µH for a 113 mm² coil). Such coils can advantageously be used in sensing or inductive charging applications, when flexibility and/or ultra-thin profile is required. Secondly, we demonstrated the feasibility of fine-pitch bond pads for COF (Chip-On-Flex) applications. We achieved a bond pad pitch of 80 µm (60 µm pad dimension / 20 µm pad clearance). Laser direct pattering is presented as a single step and purely dry alternative to high-end PCB manufacturing processes. Highlights PCB fine-pitch features laser direct patterning on flexible substrate was demonstrated. Laser patterning is presented as a single step and purely dry alternative to high-end PCB manufacturing processes. Feature sizes, edges straightness and damage depth were compared for several parameter sets. Planar 2D coils and fine pitch land pattern for COF (Chip-On-Flex) applications were realized.

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[해외논문] Fine pitch features laser direct patterning on flexible printed circuit board

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