Abstract ▼ AI-Helper

The fluid flow, mass transfer and film thickness variation during a wafer spin coating process are numerically studied. Governing equations for the cylindrical coordinates are simplified using the similarity transformation and solved efficiently using the finite difference method. Concentration depe...

The fluid flow, mass transfer and film thickness variation during a wafer spin coating process are numerically studied. Governing equations for the cylindrical coordinates are simplified using the similarity transformation and solved efficiently using the finite difference method. Concentration dependent viscosity and the binary diffusivity of the coating liquid are used in the analysis. The time variational velocity components of the coating liquid and the film thickness are analyzed according to the various spin speed. When the evaporation is considered, the flow decease in the early times due to the increase of the viscosity and the resultant flow resistance. Effects of the two film thinning mechanism, the flow-out and evaporation are also considered in the analysis.