초록 ▼

A method for simultaneously soldering the two solder covered ends of an electronic chip component to respective conductor pads. Pulsed coherent laser radiation having a predetermined energy profile is separated into two spacially separate beams and they are respectively directed toward the opposing

A method for simultaneously soldering the two solder covered ends of an electronic chip component to respective conductor pads. Pulsed coherent laser radiation having a predetermined energy profile is separated into two spacially separate beams and they are respectively directed toward the opposing ends of the chip to reflow the solder.

대표청구항 ▼

A method of soldering an electronic chip component having solder on opposing ends to two supporting conductor pads connected to a substrate, comprising the steps of: providing pulsed coherent laser radiation having pulse widths of less than 10 milliseconds with a repetition rate of less than 10 puls

A method of soldering an electronic chip component having solder on opposing ends to two supporting conductor pads connected to a substrate, comprising the steps of: providing pulsed coherent laser radiation having pulse widths of less than 10 milliseconds with a repetition rate of less than 10 pulses per second, the pulse train duration of said radiation being less than one second; separating said radiation into two simultaneous spatially separate beams having substantially equal energy; directing said beams inward toward said opposing ends of said electronic chip component to reflow said solder; and removing said beams to substantially simultaneously form solder joints between said component and said pads.