초록 ▼

Fine wires are soldered without flux to solder pads on a flexible circuit of a workpiece by a laser. The laser beam is aligned and moved over the solder pad to describe a rectangle by movement of mirrors on a programmed, motor driven X-Y-Z linear table. Wires are deeply sunk into the solder pads by

Fine wires are soldered without flux to solder pads on a flexible circuit of a workpiece by a laser. The laser beam is aligned and moved over the solder pad to describe a rectangle by movement of mirrors on a programmed, motor driven X-Y-Z linear table. Wires are deeply sunk into the solder pads by the weight of a cone brought against the wire carried by the X-Y-Z table. Vaporized insulation is restrained within the cone to maintain a clean microelectronic workpiece.

대표청구항 ▼

Apparatus for soldering fine wires to a solder pad on a microelectronic workpiece, the apparatus comprising: (a) laser beam discharge means for soldering wires to a solder pad on a workpiece; (b) work station means including an X-Y-Z positioning fixture for aligning a laser beam from said laser beam

Apparatus for soldering fine wires to a solder pad on a microelectronic workpiece, the apparatus comprising: (a) laser beam discharge means for soldering wires to a solder pad on a workpiece; (b) work station means including an X-Y-Z positioning fixture for aligning a laser beam from said laser beam discharge means upon a solder pad of a workpiece; (c) fixture means for holding a workpiece having solder pads such that said solder pads may be in alignment with said laser beam; and (d) said workstation means further including cone means including a cone constructed and arranged such that said laser beam passes through said cone, and said cone means including a cone holder constructed and arranged such that said cone may be positioned onto a wire placed over a solder pad such that said wire may be pushed into said solder pad solely by the weight of said cone when said solder pad is heated by a laser beam.