초록 ▼

A method for improving etch uniformity during a wet etching process is disclosed. The method comprises the steps of first rinsing the wafer to form a water film over the wafer surface, followed by liquid phase etching. The water film helps the subsequent viscous etchant to be spread across the wafer

A method for improving etch uniformity during a wet etching process is disclosed. The method comprises the steps of first rinsing the wafer to form a water film over the wafer surface, followed by liquid phase etching. The water film helps the subsequent viscous etchant to be spread across the wafer surface more uniformly to thereby improve the etch uniformity.

대표청구항 ▼

[ What is claimed is:] [1.] A method for improving etch uniformity during a wet etching process, comprising the steps of:providing a semiconductor wafer having a layer formed thereon; andforming a water film over the wafer surface prior to etching said layer with a viscous acid solution comprising s

[ What is claimed is:] [1.] A method for improving etch uniformity during a wet etching process, comprising the steps of:providing a semiconductor wafer having a layer formed thereon; andforming a water film over the wafer surface prior to etching said layer with a viscous acid solution comprising sulfuric acid and an etchant selected from the group consisting of hydrofluoric acid, nitric acid, phosphoric acid, acetic acid, and mixtures thereof.