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[미국특허] Overlay marks, methods of overlay mark design and methods of overlay measurements 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06K-009/00
출원번호 US-0394938 (2006-03-30)
등록번호 US-7317824 (2008-01-08)
발명자 / 주소
  • Ghinovker,Mark
  • Adel,Michael
  • Mieher,Walter Dean
  • Levy,Ady
  • Wack,Dan
출원인 / 주소
  • KLA Tencor Technologies Corporation
대리인 / 주소
    Beyer Weaver LLP
인용정보 피인용 횟수 : 12  인용 특허 : 75

초록

An overlay mark for determining the relative shift between two or more successive layers of a substrate is disclosed. The overlay mark includes at least one test pattern for determining the relative shift between a first and a second layer of the substrate in a first direction. The test pattern inc

대표청구항

What is claimed is: 1. A method for determining the relative shift between two or more successive layers of a substrate, the method comprising: capturing an image of an overlay mark formed on the substrate, the overlay mark having a plurality of working zones and comprising: at least one test patte

이 특허에 인용된 특허 (75)

  1. Tomimatu Yoshikatu,JPX, Aberration estimation reticle for determining overlay error.
  2. Ohta Masakatsu (Yokohama JPX) Ina Hideki (Kawasaki JPX) Suzuki Akiyoshi (Tokyo JPX), Alignment and exposure apparatus.
  3. Dirksen Peter,NLX ; Nuijs Antonius M.,NLX, Alignment device and lithographic apparatus comprising such a device.
  4. Senda Shinya (Kawasaki JPX) Haraguchi Hiroshi (Tokyo JPX), Alignment method.
  5. Kaiser Paul (Munich DEX), Alignment patterns for two objects to be aligned relative to each other.
  6. Mller Karl-Heinz (Berlin DEX), Apparatus for adjusting a mask with at least one adjustment mark relative to a semi-conductor wafer provided with at lea.
  7. Brunner Timothy A. (Norwalk CT), Apparatus for measuring overlay error.
  8. Van Den Brink Marinus A. (Veldhoven NLX) Linders Henk F. D. (Veldhoven NLX) Wittekoek Stefan (Veldhoven NLX), Apparatus for projecting a mask pattern on a substrate.
  9. Wittekoek Stefan (Bergeyk NLX) van den Brink Marinus A. (Eindhoven NLX), Apparatus for projecting a mask pattern on a substrate.
  10. Ausschnitt Christopher P. ; Nyyssonen ; deceased Diana ; Swing ; executor by Jeffrey, Combined segmented and nonsegmented bar-in-bar targets.
  11. Ausschnitt Christopher P. ; Muth William A., Edge overlay measurement target for sub-0.5 micron ground rules.
  12. Cresswell Michael (Frederick MD) Allen Richard (Germantown MD) Linholm Loren (Ijamsville MD) Gaitan Michael (Gaithersburg MD), Electrical test structure and method for measuring the relative locations of conducting features on an insulating substr.
  13. Penzes William B. ; Allen Richard A. ; Cresswell Michael W. ; Linholm Loren W. ; Teague E. Clayton, Electrical test structure and method for measuring the relative locations of conductive features on an insulating substr.
  14. Ausschnitt Christopher P. ; Progler Christopher J., Enhanced optical detection of minimum features using depolarization.
  15. Shimoda Isamu (Zama JPX) Kariya Takao (Hino JPX) Mizusawa Nobutoshi (Yamato JPX) Ozawa Kunitaka (Isehara JPX) Uzawa Shunichi (Nakamachi JPX), Exposure method.
  16. Brunner Timothy A. (Palo Alto CA), Focus and overlay characterization and optimization for photolithographic exposure.
  17. Arie J. den Boef NL, Lithographic projection apparatus.
  18. Adams Thomas Evans, Lithography tool adjustment utilizing latent imagery.
  19. Norishima Masayuki (Setagaya JPX) Toyoshima Yoshiaki (Matsudo JPX) Matsunaga Takeshi (Yokohama JPX), Mask for evaluation of aligner and method of evaluating aligner using the same.
  20. Chappelow Ronald E. (Essex Junction VT) Hayes ; deceased Lawrence P. (late of Binghamton NY by Ellen J. Hayes ; administratrix), Measurement of registration of overlaid test patterns by the use of reflected light.
  21. Taylor Roy Y. (Scottsville NY), Method and apparatus for aligning depth images.
  22. Brueck Steven R. J. (5601 Cometa Ct. NE. Albuquerque NM 87111) Zaidi Saleem H. (6020 Kathryn SE. ; Apt. #24 Albuquerque NM 87108), Method and apparatus for alignment and overlay of submicron lithographic features.
  23. Bouwhuis Gijsbertus (Eindhoven NLX) Lamboo Theodorus F. (Eindhoven NLX), Method and arrangement for aligning a mask pattern relative to a semiconductor substrate.
  24. Cresswell Michael W. (Frederick MD) Allen Richard A. (Germantown MD) Kopanski Joseph J. (Takoma Park MD) Linholm Loren W. (Ijamsville MD), Method and reference standards for measuring overlay in multilayer structures, and for calibrating imaging equipment as.
  25. Yamashita Kazuhiro,JPX ; Muro Masahiro,JPX, Method and system for measurement of resist pattern.
  26. Hsu Shun-Liang,TWX ; Jang Syun-Ming,TWX ; Lin Chang-Song,TWX, Method for alignment mark regeneration.
  27. Vento Giuseppe (Agrate Brianza ITX), Method for evaluating processing parameters in the manufacture of semiconductor devices.
  28. Hwang Joon (Bubaleub KRX), Method for fabricating a semiconductor with a photomask.
  29. Leroux Pierre ; Satyendra Sethi ; Ziger David, Method for measuring dimensional anomalies in photolithographed integrated circuits using overlay metrology, and masks t.
  30. Ausschnitt Christopher P. ; Wiltshire Timothy J., Method for overlay control system.
  31. Bae Sang Man,KRX, Method for testing overlay in a semiconductor device utilizing inclined measuring mark.
  32. van den Brink Martinus A. (Veldhoven NLX) van Eijk Jan (Eindhoven NLX), Method of aligning a mask and a substrate relative to each other and arrangement for carrying out the method.
  33. Tounai Keiichiro (Tokyo JPX), Method of fabricating semiconductor device including step of forming superposition error measuring patterns.
  34. Davidson Mark (Palo Alto CA) Kaufman Kalman (Haifa ILX) Mazor Isaac (Haifa ILX), Method of image enhancement for the coherence probe microscope with applications to integrated circuit metrology.
  35. Nishimoto Shozo (Tokyo JPX), Method of manufacturing a semiconductor device using a main vernier pattern formed at a right angle to a subsidiary vern.
  36. Ausschnitt Christopher P. ; Muth William A., Method of measuring bias and edge overlay error for sub-0.5 micron ground rules.
  37. Kusonose Haruhiko (Itami JPX) Kozawa Hidehiko (Itami JPX), Method of monitoring accuracy with which patterns are written.
  38. Ausschnitt Christopher Perry ; Brunner Timothy Allan, Method of optical metrology of unresolved pattern arrays.
  39. Dirksen Peter (Eindhoven NLX) Van Der Werf Jan E. (Eindhoven NLX), Method of repetitively imaging a mask pattern on a substrate, and apparatus for performing the method.
  40. Allen Richard A. (Gaithersburg MD) Cresswell Michael W. (Gaithersburg MD), Methods and test structures for measuring overlay in multilayer devices.
  41. Harvey David S. (Rotherham GB2) Wilson David T. (Worrall GB2), Molten metal gas analysis.
  42. Angeley David (Bridgeport CT) Drazkiewicz Stan (Newtown CT) Gallatin Gregg (Newtown CT), Off axis alignment system for scanning photolithography.
  43. Smith Henry I. (Sudbury MA) Modiano Alberto M. (Cambridge MA) Moon Euclid E. (Boston MA), On-axis interferometric alignment of plates using the spatial phase of interference patterns.
  44. Ausschnitt Christopher P. ; Brunner Timothy A., Optical metrology tool and method of using same.
  45. Hiratsuka Tsuyoshi,JPX, Overlay accuracy measuring method.
  46. Noah Bareket, Overlay alignment mark design.
  47. Bareket Noah, Overlay alignment measurement of wafers.
  48. Bareket Noah, Overlay alignment measurement of wafers.
  49. Tomimatu Yoshikatu,JPX, Overlay error determination mark considering influence of aberration.
  50. Adel, Michael; Ghinovker, Mark, Overlay marks, methods of overlay mark design and methods of overlay measurements.
  51. Adel,Michael; Ghinovker,Mark; Mieher,Walter Dean, Overlay marks, methods of overlay mark design and methods of overlay measurements.
  52. Adel,Michael; Ghinovker,Mark; Mieher,Walter Dean, Overlay marks, methods of overlay mark design and methods of overlay measurements.
  53. Adel,Michael; Ghinovker,Mark; Mieher,Walter Dean; Levy,Ady; Wack,Dan, Overlay marks, methods of overlay mark design and methods of overlay measurements.
  54. Ghinovker,Mark; Adel,Michael; Mieher,Walter Dean; Levy,Ady; Wack,Dan, Overlay marks, methods of overlay mark design and methods of overlay measurements.
  55. Kawai Kenji,JPX, Overlay measuring method using correlation function.
  56. Cresswell Michael William ; Linholm Loren Wendell ; Allen Richard A., Overlay target and measurement procedure to enable self-correction for wafer-induced tool-induced shift by imaging sens.
  57. Lin Hua-Tai,TWX ; Shiau Gwo-Yuh,TWX ; Wang Pin-Ting,TWX, Overlay target pattern and algorithm for layer-to-layer overlay metrology for semiconductor processing.
  58. Brunner Timothy A. (Norwalk CT), Overlay test measurement systems.
  59. Ausschnitt, Christopher P., Overlay test wafer.
  60. Nagoya Takatoshi (Annaka JPX), Pattern shift measuring method.
  61. Mitsui Tadashi (Wappingers Falls NY) Hieda Katsuhiko (Wappingers Falls NY), Plurality of photolithographic alignment marks with shape, size and spacing based on circuit pattern features.
  62. Mazor Isaac (Haifa ILX) Knoll Noam (Zicron Jackob ILX) Uziel Yoram (Kibutz Yodfat ILX), Process for measuring overlay misregistration during semiconductor wafer fabrication.
  63. Yanagisawa Masayuki (Tokyo JPX), Process of manufacturing semiconductor devices.
  64. Ausschnitt Christopher P., Segmented bar-in-bar target.
  65. Chen Jeng-Horng,TWX ; Shih Tsu,TWX, Segmented box-in-box for improving back end overlay measurement.
  66. Komuro Masahiro,JPX, Semiconductor device including alignment marks.
  67. Kepler Nick ; Karlsson Olov ; Wang Larry ; Bandyopadhyay Basab ; Ibok Effiong ; Lyons Christopher F., Stepper alignment mark structure for maintaining alignment integrity.
  68. Stanton Stuart (Bridgewater NJ) White Donald L. (Morris Plains NJ) Zipfel ; Jr. George G. (Summit NJ), Sub-micron through-the-lens positioning utilizing out of phase segmented gratings.
  69. Jackson Ricky A., System and method for alignment of integrated circuits multiple layers.
  70. Cresswell Michael W. ; Mayo Santos ; Lowney Jeremiah R., Target configuration and method for extraction of overlay vectors from targets having concealed features.
  71. Jones Harris C. ; Ryan James G., Technique for extending the limits of photolithography.
  72. Weber Charles M. (Santa Clara CA), Test method for random defects in electronic microstructures.
  73. Morris James R. (South Bend IN) White James A. (Elkhart IN), Test strip identification and instrument calibration.
  74. Steffan Paul J. ; Yu Allen S., Universal alignment marks for semiconductor defect capture and analysis.
  75. Hsia Liang-Choo (Taipei TWX) Chang Thomas (Hsin-Chu TWX), Wafer metrology pattern integrating both overlay and critical dimension features for SEM or AFM measurements.

이 특허를 인용한 특허 (12)

  1. Adel, Michael; Mieher, Walter D.; Ghinovker, Mark, Apparatus and methods for detecting overlay errors using scatterometry.
  2. Ghinovker, Mark, Apparatus and methods for determining overlay of structures having rotational or mirror symmetry.
  3. Ghinovker, Mark, Apparatus and methods for determining overlay of structures having rotational or mirror symmetry.
  4. Ghinovker, Mark, Apparatus and methods for determining overlay of structures having rotational or mirror symmetry.
  5. Ghinovker, Mark, Apparatus and methods for determining overlay of structures having rotational or mirror symmetry.
  6. Ghinovker, Mark; Adel, Michael; Mieher, Walter D.; Levy, Ady; Wack, Dan, Apparatus for measuring overlay errors.
  7. Jin, Wen; Vuong, Vi; Mieher, Walter Dean, Determination of training set size for a machine learning system.
  8. Liou, En-Chiuan; Hsu, Chia-Chang; Kuo, Teng-Chin; Wang, Chia-Hung; Yu, Tuan-Yen; Pai, Yuan-Chi; Yu, Chun-Chi, Method of correcting overlay error.
  9. Sapiens, Noam; Seligson, Joel; Levinski, Vladimir; Kandel, Daniel; Feler, Yoel; Bringoltz, Barak; Manassen, Amnon; Benisty, Eliav, Near field metrology.
  10. Liou, En-Chiuan; Hsu, Chia-Chang; Chen, Yi-Ting; Kuo, Teng-Chin; Yu, Chun-Chi, Overlap mark set and method for selecting recipe of measuring overlap error.
  11. Ghinovker, Mark; Adel, Michael; Mieher, Walter D.; Levy, Ady; Wack, Dan, Overlay marks and methods of manufacturing such marks.
  12. Ghinovker, Mark; Adel, Michael; Mieher, Walter Dean; Levy, Ady; Wack, Dan, Overlay marks, methods of overlay mark design and methods of overlay measurements.
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