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A vertical-type probe card includes a circuit board, which has signal circuits and grounding circuits arranged in such a manner that each signal circuit is disposed in parallel and adjacent to one grounding circuit and kept a predetermined distance from the grounding circuit, and a probe assembly, w

A vertical-type probe card includes a circuit board, which has signal circuits and grounding circuits arranged in such a manner that each signal circuit is disposed in parallel and adjacent to one grounding circuit and kept a predetermined distance from the grounding circuit, and a probe assembly, which is arranged at the bottom side of the circuit board and has an upper guide plate, a lower guide plate, a conducting layer provided on the lower guide plate, a plurality of signal probes respectively electrically connected to the signal circuits and adjacent to a plurality of compensation probes, and at least one grounding probe electrically connected to the grounding circuits in a manner that the signal, compensation and grounding probes are vertically inserted through the upper and lower guide plates, and the conducting layer is conducted with the compensation probe and the grounding probe while electrically insulated to the signal probe.

대표청구항 ▼

What is claimed is: 1. A vertical-type probe card comprising: a circuit board having a top surface, a bottom surface opposite to the top surface, a plurality of signal circuits and a plurality of grounding circuits; and a probe assembly located below the bottom surface of said circuit board, said p

What is claimed is: 1. A vertical-type probe card comprising: a circuit board having a top surface, a bottom surface opposite to the top surface, a plurality of signal circuits and a plurality of grounding circuits; and a probe assembly located below the bottom surface of said circuit board, said probe assembly comprising: an upper guide plate mounted on said circuit board; a lower guide plate defining with the upper guide plate a receiving chamber therebetween; a conducting layer made of conducting material and disposed on the lower guide plate; a plurality of signal probes made of conducting material and respectively electrically connected to said signal circuits; at least one grounding probe made of conducting material and electrically connected to said grounding circuits and said conducting layer, and at least one compensation probe made of conducting material and electrically connected to said conducting layer and arranged in parallel and adjacent to at least one of said signal probes; wherein said signal probe, said at least one compensation probe and said at least one grounding probe are inserted through said upper guide plate and said lower guide plate, and said signal probes and said at least one grounding probe are flexible in said receiving chamber. 2. The vertical-type probe card as claimed in claim 1, which said signal circuits comprise a plurality of transmission lines extending from said top surface to said probe assembly; said signal probes are respectively electrically connected to the transmission lines of said signal circuits. 3. The vertical-type probe card as claimed in claim 2, wherein each of said signal circuits is disposed in parallel and adjacent to at least one of said grounding circuits and kept apart from the adjacent at least one of said grounding circuits at a predetermined distance. 4. The vertical-type probe card as claimed in claim 3, further comprising a probe holder mounted to said circuit board and provided with a top open chamber for receiving the transmission lines of said signal circuits, a bottom surface adjacent to said probe assembly, and a grounding plane disposed on the bottom surface and electrically connected to said grounding circuits, wherein said transmission lines pass through said grounding plane and then are respectively connected with said signal probes. 5. The vertical-type probe card as claimed in claim 1, wherein said signal circuits and said grounding circuits are embedded in said circuit board. 6. The vertical-type probe card as claimed in claim 5, further comprising a space transformer arranged between said circuit board and said probe assembly, said space transformer having a plurality of signal wires and grounding wires arranged inside, said signal wires being respectively electrically connected to said signal circuits, said groundings wire being respectively electrically connected to said grounding circuits, said signal wires and said grounding wires each having a top end terminating in a top solder ball bonded to said circuit board and a bottom end terminating in a bottom solder ball bonded to said probe assembly, the pitch among the adjacent top solder balls being greater than the pitch among the adjacent bottom solder balls. 7. The vertical-type probe card as claimed in claim 6, wherein the signal probes are respectively connected to the signal wires of said space transformer, and said grounding probe is connected to the grounding wire of said space transformer. 8. The vertical-type probe card as claimed in claim 1, wherein said signal probe, said grounding probe, and said compensation probe each have a tip suspending beneath said lower guide plate, the length of the tip of said compensation probe being smaller than the length of the tips of said signal probe and said grounding probe, the tips of said signal probes and said grounding probe being used to probe a test sample. 9. The vertical-type probe card as claimed in claim 1, wherein said conducting layer has a plurality of openings; said signal probes are respectively inserted through the openings of said conducting layer and electrically insulated from said conducting layer.