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Embodiments of a gas distribution plate for distributing gas in a processing chamber are provided. In one embodiment, a gas distribution plate includes a diffuser plate having an upstream side and a downstream side, and a plurality of gas passages passing between the upstream and downstream sides of

Embodiments of a gas distribution plate for distributing gas in a processing chamber are provided. In one embodiment, a gas distribution plate includes a diffuser plate having an upstream side and a downstream side, and a plurality of gas passages passing between the upstream and downstream sides of the diffuser plate. At least one of the gas passages has a right cylindrical shape for a portion of its length extending from the upstream side and a coaxial conical shape for the remainder length of the diffuser plate, the upstream end of the conical portion having substantially the same diameter as the right cylindrical portion and the downstream end of the conical portion having a larger diameter. The gas distribution plate is relatively easy to manufacture and provides good chamber cleaning rate, good thin film deposition uniformity and good thin film deposition rate. The gas distribution plate also has the advantage of reduced chamber cleaning residues on the diffuser surface and reduced incorporation of the cleaning residues in the thin film being deposited.

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1. A method of depositing a thin film on a substrate, comprising: placing a substrate in a process chamber with a diffuser plate having an upstream side, a downstream side, and a plurality of gas passages passing between the upstream and downstream sides, wherein each of the gas passages has a first

1. A method of depositing a thin film on a substrate, comprising: placing a substrate in a process chamber with a diffuser plate having an upstream side, a downstream side, and a plurality of gas passages passing between the upstream and downstream sides, wherein each of the gas passages has a first cylindrical shape for a portion of its length extending from the upstream side, a first coaxial conical shape for a portion of its length extending from the downstream side, a second coaxial cylindrical shape with a smaller diameter than the first cylindrical shape disposed between the first cylindrical shape and the first coaxial conical shape, and a second coaxial conical shape connecting the second coaxial cylindrical shape with the first coaxial conical shape, wherein the first coaxial conical shape has a larger diameter at the downstream side than the diameter of the first cylindrical shape at the upstream side;flowing a gas through the plurality of gas passages;generating plasma between the diffuser plate and the substrate, such that a hollow cathode effect is created within the first coaxial conical shape of the gas passages; anddepositing a thin film on the substrate in the process chamber. 2. The method of claim 1, wherein the diffuser plate is rectangular. 3. The method of claim 2, wherein the gas comprises a mixture of a silicon containing gas and a nitrogen containing gas. 4. The method of claim 2, wherein the gas comprises a mixture of a silicon containing gas and a hydrogen containing gas. 5. The method of claim 2, further comprising modifying the diameter of the second coaxial cylindrical shape to adjust the deposition rate. 6. A method of depositing a thin film on a substrate, comprising: placing a substrate in a process chamber coupled to a silicon source, the process chamber having a diffuser plate having an upstream side, a downstream side, and a plurality of gas passages passing between the upstream and downstream sides, wherein each of the gas passages has a first cylindrical shape for a portion of its length extending from the upstream side, a second coaxial cylindrical shape with a smaller diameter than the first cylindrical shape for a portion of its length extending downstream of the first cylindrical shape, a first coaxial conical shape extending downstream from the second coaxial cylindrical shape, and a second coaxial conical shape extending downstream from the first coaxial conical shape to the downstream side of the diffuser plate, with the upstream end of the first coaxial conical shape having substantially the same diameter as the second coaxial cylindrical shape and the downstream end of the second coaxial conical shape having a larger diameter than the diameter of the first cylindrical shape;flowing a gas through each of the gas passages;generating plasma between the diffuser plate and the substrate, such that a hollow cathode effect is created within the second coaxial conical shape of each of the gas passages; anddepositing a thin film on the substrate in the process chamber. 7. The method of claim 6, wherein the diffuser plate is rectangular. 8. The method of claim 7, wherein the gas comprises a mixture of a silicon containing gas and a nitrogen containing gas. 9. The method of claim 7, wherein the gas comprises a mixture of a silicon containing gas and a hydrogen containing gas. 10. The method of claim 7, further comprising modifying the diameter of the second coaxial cylindrical shape to adjust the deposition rate. 11. A method of cleaning a process chamber, comprising: placing a substrate in a process chamber coupled to a remote plasma source and the remote plasma source is coupled to a fluorine source, the process chamber having a diffuser plate with an upstream side, a downstream side, and a plurality of gas passages passing between the upstream and downstream sides, wherein each of the gas passages has a first cylindrical shape for a portion of its length extending from the upstream side, a second coaxial cylindrical shape with a smaller diameter than the first cylindrical shape for a portion of its length extending downstream of the first cylindrical shape, a first coaxial conical shape extending downstream from the second coaxial cylindrical shape, and a second coaxial conical shape extending downstream from the first coaxial conical shape to the downstream side of the diffuser plate, with the upstream end of the first coaxial conical shape having substantially the same diameter as the second coaxial cylindrical shape and the downstream end of the second coaxial conical shape having a larger diameter than the diameter of the first cylindrical shape;flowing a gas through each of the gas passages;generating plasma between the diffuser plate and the substrate, such that a hollow cathode effect is created within the second coaxial conical shape of each of the gas passages;depositing a thin film on the substrate in the process chamber;determining if the number of processed substrates has reached a pre-determined cleaning limit;repeating the placing a substrate in the process chamber, flowing a gas, generating a plasma, depositing a thin film on the substrate, and determining if the number of processed substrates has reached the pre-determined cleaning limit until the number of process substrates has reached the pre-determined cleaning limit; andcleaning the process chamber when the number of processed substrates reaches the pre-determined cleaning limit. 12. The method of claim 11, wherein the diffuser plate is rectangular. 13. The method of claim 12, wherein the gas comprises a mixture of a silicon containing gas and a nitrogen containing gas. 14. The method of claim 12, wherein the gas comprises a mixture of a silicon containing gas and a hydrogen containing gas. 15. The method of claim 12, wherein the cleaning is performed by a remote plasma source cleaning process with inert gas flowing at between about 0 slm to about 6 slm, fluorine containing gas flowing at between 1 slm to about 6 slm, and the pressure of the remote plasma source generator is maintained at between about 0.5 Torr to about 20 Torr. 16. The method of claim 11, further comprising modifying the diameter of the second coaxial cylindrical shape to adjust the cleaning rate. 17. The method of claim 12, further comprising modifying the diameter of the second coaxial cylindrical shape to adjust the deposition rate. 18. The method of claim 1, wherein the thin film is an amorphous silicon thin film. 19. The method of claim 6, wherein the thin film is an amorphous silicon thin film. 20. The method of claim 11, wherein the thin film is an amorphous silicon thin film.