최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기International journal of precision engineering and manufacturing, v.5 no.3, 2004년, pp.11 - 18
Kim, Jae-Yeol (Department of mechatronics engineering, Chosun University) , Yoon, Sung-Un (Department of mechanical engineering, Chosun University) , Kim, Chang-Hyun (Department of precision mechanical engineering, Graduate school, Chosun University)
In this paper, the classification of artificial defects in semiconductor packages is studied by using pattern recognition technology. For this purpose, the pattern recognition algorithm includes the user made MATLAB code. And preprocess is made of the image process and self-organizing map, which is ...
Kim, Jae-Yeol, 'A Study on the Image Processing of Micro-defects Detection of Semiconductor Package by Ultrasonic Wave,' Ph. D thesis, Hanyang University, 1990
Lawrence, C. Steve, and Lee, Giles and Tsoi, Ah Chung and Back, D. Andrew, 'Face Recognition: A Convolutional Neural Network Approach,' IEEE Transaction on Neural Network, Special Issue on Neural Network and Pattern Recognition, Vol. 8, No. 1, pp. 98 - 113, 1997
Master, Timothy, 'Signal and Image Processing with Neural Networks,' John Wiley & Sons, 1994.
Kohonen, T., 'The self-organizing map,' Proceedings of the IEEE, Vol. 78, pp. 1464 - 1480, 1990
Otsu, Nobuyuki, 'A Threshold Selection Method from Gray-Level Histograms,' IEEE Transaction on Systems, Men, and Cybernetics, Vol. SMC-9, No. 1, pp. 41 - 47, 1986
Tompson, R. B., 'Quantitative Ultrasonic Non-destructive Evaluation Methods,' Journal of Applied Mechanics, Vol. 50, pp. 1991 - 1201, 1983
Hall, E. L., 'A Survey of Preprocessing and Feature Extraction Techniques for Radiographic Image,' IEEE Transaction on Computation, Vol. C-20, No. 9, pp. 1032 - 1044, 1971
Jhang, K. Y. and Jang, H. S. and Park, P. Y., 'Separation of Superimposed Pulse-Echo Signal for Improvement of Resolution of Scanning Acoustic Microscope,' Journal of the KSPE, Vol. 17, No. 7, pp. 217 - 225, 2000
Kim, J. Y. and Hong, W. and Han, J. H., 'A Study on the Detection of Interfacial Defect to Boundary Surface in Semiconductor Packages by Ultrasonic Signal Processing,' Journal of KSNT, Vol. 19, No. 5, pp. 369 - 377, 1999
Sim, J. H. and Kweon, H. J. and Paik, I. H., 'Identification of the Chip Form Using Neural Network,' Journal of the KSPE, Vol. 15, No. 12, pp. 517 - 112, 1998
Choi, M. Y. and Park, I. G. and Han, E. K., 'Measurement of Defects with Scanning Acoustic Microscope and Acoustic Emission,' Journal of the KSPE, Vol. 8, No. 4, pp. 118 - 125, 1991
※ AI-Helper는 부적절한 답변을 할 수 있습니다.