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NTIS 바로가기한국정밀공학회지 = Journal of the Korean Society for Precision Engineering, v.21 no.10 = no.163, 2004년, pp.26 - 33
김상철 (부산대학교 정밀기계공학과) , 이상직 (부산대학교 정밀기계공학과) , 정해도 (부산대학교 정밀정형 및 금형가공연구소) , 최헌종 (한국생산기술연구원) , 이석우 (한국생산기술연구원)
Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which cons...
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